Patents by Inventor David Loo

David Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Waste processing method and apparatus
    Patent number: 9975795
    Abstract: Methods and systems are provided for aerobic digestion of organic waste material.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 22, 2018
    Assignee: R3D3, Inc.
    Inventors: Kevin Chung, David Loo, Gary Kaneshiro, Alan Kaneshiro
  • Waste Processing Method and Apparatus
    Publication number: 20160023928
    Abstract: Methods and systems are provided for aerobic digestion of organic waste material.
    Type: Application
    Filed: December 27, 2013
    Publication date: January 28, 2016
    Applicant: R3D3, Inc.
    Inventors: Kevin Chung, David Loo, Gary Kaneshiro, Alan Kaneshiro
  • Dynamic Partitioning of Streaming Data
    Publication number: 20150293974
    Abstract: A real time data analysis and data filtering system for managing streaming data is presented. The method breaks a stream of data into a set of queues that are themselves streaming data but that are handled separately by unique processing steps. The queues are dynamically created on an as needed basis based on inspection of the data. In this manner the speed and efficiency of parallel processing is applied to serially streaming data. A method of filtering the data to present the new streaming data queues is also described. The method makes use of keys that are used to filter the data stream into individual queues. In another embodiment a pre-processing step includes creation of keys and insertion of keys into the streaming data to enable subsequent data mining to be accomplished on a less powerful computing device.
    Type: Application
    Filed: April 10, 2014
    Publication date: October 15, 2015
    Inventor: David Loo
  • High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications
    Patent number: 6875927
    Abstract: A high temperature cable includes wire bundle having a plurality of copper strands, where each copper strand has a barrier coating and an anti-oxidation coating disposed thereon. A mica-based layer is wrapped around a length of the wire bundle and a fiberglass layer is disposed over the mica-based layer.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: April 5, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Karl Brown, Cheng-Hsiung (Matt) Tsai, Donny Young, Vineet Mehta, David Loo
  • Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
    Patent number: 6625003
    Abstract: A bipolar electrostatic chuck containing apparatus, and a concomitant method, for balancing an electrostatic force that the bipolar electrostatic chuck imparts upon a workpiece. More specifically, the bipolar electrostatic chuck contains a chuck body having a pair of electrodes embedded therein, a primary power supply and an offset power supply. Each electrode within the bipolar electrostatic chuck is respectively connected to a terminal on the primary power. Based upon a voltage produced by the primary power supply and a bias voltage of the workpiece, an offset voltage is applied by the offset power supply to one of the terminals, thus balancing the electrostatic force applied to the workpiece.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: September 23, 2003
    Assignee: Applied Materials, Inc.
    Inventors: David Loo, Jr-Jyan Chen, Kenny K. Ngan, Bradley O. Stimson
  • High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications
    Publication number: 20030169553
    Abstract: A high temperature cable includes wire bundle having a plurality of copper strands, where each copper strand has a barrier coating and an anti-oxidation coating disposed thereon. A mica-based layer is wrapped around a length of the wire bundle and a fiberglass layer is disposed over the mica-based layer.
    Type: Application
    Filed: March 8, 2002
    Publication date: September 11, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Karl Brown, Cheng-Hsiung Matt Tsai, Donny Young, Vineet Mehta, David Loo
  • Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
    Publication number: 20030053283
    Abstract: A bipolar electrostatic chuck containing apparatus, and a concomitant method, for balancing an electrostatic force that the bipolar electrostatic chuck imparts upon a workpiece. More specifically, the bipolar electrostatic chuck contains a chuck body having a pair of electrodes embedded therein, a primary power supply and an offset power supply. Each electrode within the bipolar electrostatic chuck is respectively connected to a terminal on the primary power. Based upon a voltage produced by the primary power supply and a bias voltage of the workpiece, an offset voltage is applied by the offset power supply to one of the terminals, thus balancing the electrostatic force applied to the workpiece.
    Type: Application
    Filed: November 1, 2002
    Publication date: March 20, 2003
    Applicant: APPLIED MATERIALS, INC.
    Inventors: David Loo, Jr-Jyan Chen, Kenny K. Ngan, Bradley O. Stimson