Patents by Inventor David Lynn Artman

David Lynn Artman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
    Patent number: 9763317
    Abstract: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 12, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: James A. Mass, David Lynn Artman, Timothy A. Frank
  • METHOD AND APPARATUS FOR PROVIDING A GROUND AND A HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD
    Publication number: 20140268580
    Abstract: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: James A. Mass, David Lynn Artman, Timothy A. Frank