Abstract: A system for testing functionality of die on a wafer including a plurality of contacts includes a support structure and a plurality of probes mounted to the support structure in an array. A configuration of each of the plurality of probes varies based on a position of the probe within the array to maintain uniform engagement between the plurality of probes and a corresponding plurality of contacts across the array.

Abstract: A probe includes a pedestal and at least one feature extending from the pedestal to engage a surface of a corresponding contact at a position offset from a central longitudinal axis of the contact.

Abstract: A food processor is provided which includes a container, a blade assembly, and a base arranged such that the container is coupleable to the base. The base includes a housing and a motor configured to drive the blade assembly. The food processor further includes an actuator included with the container moveable between a first position and a second, extended position. When the container is coupled to the base and the actuator is in the second, extended position, the actuator is configured to actuate a switch to permit activation of the motor, and the base is constructed such that the container can be coupled to the base when the actuator is in the second, extended position.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

Abstract: The disclosure describes a probe card assembly for nondestructive integrated circuit testing. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

Abstract: A blending apparatus is provided which includes a container defining a cavity having a center axis and a substantially rectangular cross section through the center axis. The blending apparatus further includes a lid to cover the cavity defined by the container, and an attachment to fit within the cavity and rotate about the center axis of the cavity. In some arrangements, a set of sides of the container defines (i) a substantially octagonal interior cross section through the center axis at a location adjacent a bottom of the container to prevent lodging of food products at the bottom of the container when the attachment rotates within the cavity; and (ii) a substantially square interior cross section through the center axis at a location further from the bottom of the container.

Abstract: An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof.

Abstract: A blender blade includes a body having an aperture; at least one cutting blade extending outwardly at an angle from the body, the cutting blade having a sharp edge, a blunt edge, and a cutting blade face therebetween; and a transition section between the body and the cutting blade defining the angle at which the cutting blade extends outwardly from the body, wherein the transition section includes a gusset.

Abstract: A food processor is provided which includes a container, a blade assembly, and a base arranged such that the container is coupleable to the base. The base includes a housing and a motor configured to drive the blade assembly. The food processor further includes an actuator included with the container moveable between a first position and a second, extended position. When the container is coupled to the base and the actuator is in the second, extended position, the actuator is configured to actuate a switch to permit activation of the motor, and the base is constructed such that the container can be coupled to the base when the actuator is in the second, extended position.

Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

Abstract: Food processing assemblies for rotating two processing tools inside a container at two different speeds and/or directions and methods for using such a processing assembly are disclosed. The two processing tools are vertically spaced along the longitudinal axis of the processing assembly. A motor drives the first processing tool and a transmission system, and the transmission system drives the second processing tool. The transmission system outputs a rotation speed and/or direction is different from that of the motor to drive the second processing tool. The transmission system may be located between the two processing tools within the food-containing volume of the container.

Abstract: A food processor includes at least two different types of blades to process foods. A processing assembly includes a shaft, a set of pureeing blades attached to the shaft, and a set of substantially horizontal blades attached to the shaft. Each substantially horizontal blade may have a rearwardly curved leading cutting edge. The substantially horizontal blades are positioned higher with a food processing container than the pureeing blades. In some embodiments, upwardly angled blades may be included to induce vertical circulation and/or vorticial flow of the processed food.

Abstract: A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.

Abstract: A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit.

Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.