Abstract: Various ways of integrating pulsed plasma thrusters with a spacecraft. In one embodiment, pulsed plasma thrusters are mounted on inflatable struts/booms. In another embodiment, pulsed plasma thrusters are mounted within a recess formed on an exterior surface of the spacecraft body.

Abstract: The invention is a satellite assembly suitable for use with small payloads. In detail, the invention includes a foldable flexible sheet. A housing for containing the payload of the satellite is mounted at the center of the sheet. A plurality of inflatable tubular members is coupled at a first end to the housing and along it's length to the sheet having a second end terminating at the periphery of the sheet, the tubular elements movable from a collapsed condition to an inflated condition. A plurality of flat solar panels is attached to the sheet in a manner allowing the sheet to be folded.

Abstract: The invention is a micro-satellite assembly. In detail, the invention includes first and second flat structural members containing the satellite payload. First and second tubular elements connect first and second structural members such that they are in a spaced relationship. A plurality of solar panels are movably to the tubular elements between the first and second structural elements, movable from a stored position between the structural elements to an deployed position external of these structural members. A mechanism is provided for biasing the plurality of the solar panels to the deployed position. A second mechanism is used to releasably secure the plurality of solar panels in the stored position.

Abstract: A system and apparatus provide for the packaging of electronic components as well as a monitoring system to periodically check and adjust connections between the various electronic components. A multichip module (MCM) may be employed with an interposer and circuit card interface to comprise an electronic assembly. Each of the components in the assembly includes external electrical contacts which provide for the conduction of electrical signals between the components as well as to remotely located systems. The electronics assembly further includes an actuator assembly which is employed to apply a compressive force to the electronic components in a stacked configuration and to periodically measure the resistance over a feedback circuit to determine that there is still a good electrical connections between the contacts. If the measured resistance is above a predetermined level, the compressive force may be increased to improve the electrical connections.

Abstract: Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized to receive a variety of submodules. The submodules are constructed to hold a variety of circuit elements, such as circuit dice and provide the conduction paths for establishing interconnections between these chips. These circuit elements are attached on one side of the submodule and electrical contacts are provided on the opposite side. Upon installation into the cavity in the carrier module, the submodule is flipped such that the electrical connections are exposed. Once in the cavity, a layer of flex circuitry is applied over the submodule and the ceramic carrier in order to establish electrical connection between electrical elements in the submodules as well as components external to the ceramic carrier.

Abstract: ABSTRACT OF DISCLOSURE Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized to receive a variety of submodules. The submodules are constructed to hold a variety of circuit elements, such as circuit dice and provide the conduction paths for establishing interconnections between these chips. These circuit elements are attached on one side of the submodule and electrical contacts are provided on the opposite side. Upon installation into the cavity in the carrier module, the submodule is flipped such that the electrical connections are exposed. Once in the cavity, a layer of flex circuitry is applied over the submodule and the ceramic carrier in order to establish electrical connection between electrical elements in the submodules as well as components external to the ceramic carrier.

Abstract: The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Abstract: An electrical socket used for interconnecting a multichip module to a printed circuit board or similar electrical system. The electrical socket is independent of the multichip module and permits removal and replacement of the multichip module without damaging the module and its module electrical leads. The socket includes an insulated base strip and an insulated cap strip. The base strip includes a plurality of elongated lower pockets therein for receiving and properly aligning each of the module electrical leads therein. The base strip also includes conductive pads in the bottom of and along the length of each pocket. Each conductive pad is connected to a socket lead. The socket leads are used for connection to the printed circuit board or like electrical system. The cap strip includes a plurality of elongated upper pockets therein which are dimensioned for receipt above the lower pockets of the base strip.