Patents by Inventor David M. Bond
David M. Bond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109694Abstract: A drinking vessel including a beverage container and a closure assembly attachable to the beverage container. The beverage container has a spout defining a first drinking opening and a second drinking opening. The closure assembly includes a positioning member and a sealing member. When the positioning member is in a sealing orientation, the positioning member can extend deep enough into the first drinking opening for the sealing member to seal the first drinking opening and the second drinking opening. When the positioning member is not in the sealing orientation, the positioning member cannot extend deep enough into the first drinking opening for the sealing member to seal the first drinking opening and the second drinking opening.Type: ApplicationFiled: June 5, 2023Publication date: April 4, 2024Inventors: David O. MEYERS, Jim Allen COLBY, John R. OMDAHL, II, Timothy Tyler BOND, Steven M. SORENSEN
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Patent number: 11830863Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: November 30, 2021Date of Patent: November 28, 2023Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
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Publication number: 20220085001Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: November 30, 2021Publication date: March 17, 2022Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
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Patent number: 11217573Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: March 4, 2020Date of Patent: January 4, 2022Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
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Publication number: 20210280566Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
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Patent number: 9036506Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.Type: GrantFiled: November 4, 2013Date of Patent: May 19, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Bond, Meenakshi R. Kaushik
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Patent number: 8902759Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.Type: GrantFiled: October 8, 2012Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: David M. Bond, Meenakshi R. Kaushik
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Publication number: 20140098703Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.Type: ApplicationFiled: October 8, 2012Publication date: April 10, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: DAVID M. BOND, MEENAKSHI R. KAUSHIK
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Publication number: 20140098707Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.Type: ApplicationFiled: November 4, 2013Publication date: April 10, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Bond, Meenakshi R. Kaushik
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Patent number: 6713527Abstract: The invention relates to surgical bone cement compositions and more particularly to bone cement compositions having aneasthetic properties, and to methods for producing analgesia.Type: GrantFiled: November 15, 2001Date of Patent: March 30, 2004Assignee: Queen's University at KingstonInventors: David M. Bond, John F. Rudan, Michael A. Adams
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Publication number: 20020137813Abstract: The invention relates to surgical bone cement compositions and more particularly to bone cement compositions having aneasthetic properties, and to methods for producing analgesia.Type: ApplicationFiled: November 15, 2001Publication date: September 26, 2002Applicant: Queen's University at Kingston.Inventors: David M. Bond, John F. Rudan, Michael A. Adams
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Patent number: 6355705Abstract: A polymethacrylate or other bone cement composition having analgesic properties is described. Bone cements containing up to 5% by weight of a local anaesthetic agent, such as lidocaine, have been demonstrated to elute sufficient lidocaine to provide an analgesic effect in vivo.Type: GrantFiled: April 1, 1997Date of Patent: March 12, 2002Assignee: Queen's University at KingstonInventors: David M. Bond, John F. Rudan