Patents by Inventor David M. Bond

David M. Bond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109694
    Abstract: A drinking vessel including a beverage container and a closure assembly attachable to the beverage container. The beverage container has a spout defining a first drinking opening and a second drinking opening. The closure assembly includes a positioning member and a sealing member. When the positioning member is in a sealing orientation, the positioning member can extend deep enough into the first drinking opening for the sealing member to seal the first drinking opening and the second drinking opening. When the positioning member is not in the sealing orientation, the positioning member cannot extend deep enough into the first drinking opening for the sealing member to seal the first drinking opening and the second drinking opening.
    Type: Application
    Filed: June 5, 2023
    Publication date: April 4, 2024
    Inventors: David O. MEYERS, Jim Allen COLBY, John R. OMDAHL, II, Timothy Tyler BOND, Steven M. SORENSEN
  • Patent number: 11830863
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: November 28, 2023
    Assignee: Intel Corporation
    Inventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
  • Publication number: 20220085001
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
  • Patent number: 11217573
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
  • Publication number: 20210280566
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Application
    Filed: March 4, 2020
    Publication date: September 9, 2021
    Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
  • Patent number: 9036506
    Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: May 19, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David M. Bond, Meenakshi R. Kaushik
  • Patent number: 8902759
    Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: December 2, 2014
    Assignee: International Business Machines Corporation
    Inventors: David M. Bond, Meenakshi R. Kaushik
  • Publication number: 20140098703
    Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.
    Type: Application
    Filed: October 8, 2012
    Publication date: April 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: DAVID M. BOND, MEENAKSHI R. KAUSHIK
  • Publication number: 20140098707
    Abstract: A shortest path first (SPF) computation in a distributed network may be performed efficiently by performing the SPF computation in stages. Rather than perform a new SPF computation every time a change occurs affecting a link state within the distributed network, a routing protocol may identify the change and determine if the impact to the link state necessarily needs the new SPF computation. For example, a predetermined list of events may identify changes that may not necessarily impact the SPF value(s) currently associated with the distributed network. Embodiments disclosed may avoid computation of the new SPF for changes to the link state thus managing network system resources more efficiently.
    Type: Application
    Filed: November 4, 2013
    Publication date: April 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David M. Bond, Meenakshi R. Kaushik
  • Patent number: 6713527
    Abstract: The invention relates to surgical bone cement compositions and more particularly to bone cement compositions having aneasthetic properties, and to methods for producing analgesia.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: March 30, 2004
    Assignee: Queen's University at Kingston
    Inventors: David M. Bond, John F. Rudan, Michael A. Adams
  • Publication number: 20020137813
    Abstract: The invention relates to surgical bone cement compositions and more particularly to bone cement compositions having aneasthetic properties, and to methods for producing analgesia.
    Type: Application
    Filed: November 15, 2001
    Publication date: September 26, 2002
    Applicant: Queen's University at Kingston.
    Inventors: David M. Bond, John F. Rudan, Michael A. Adams
  • Patent number: 6355705
    Abstract: A polymethacrylate or other bone cement composition having analgesic properties is described. Bone cements containing up to 5% by weight of a local anaesthetic agent, such as lidocaine, have been demonstrated to elute sufficient lidocaine to provide an analgesic effect in vivo.
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: March 12, 2002
    Assignee: Queen's University at Kingston
    Inventors: David M. Bond, John F. Rudan