Patents by Inventor David M. Craid

David M. Craid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Placement of absorbing material in a semiconductor device
    Patent number: 7045885
    Abstract: A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: May 16, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, David M. Craid, Troy D. Schwinabart