Patents by Inventor David M. Dickirson

David M. Dickirson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5694135
    Abstract: An antenna (100) has a connector (200) having a ground lead (102) and a signal lead (114). A dielectric (112) captures and embeds the connector (200) forming a connector substrate assembly (120) having a first side (122) and a second opposite side (124). A first conductive material (104) is affixed to the first side (122) of the connector substrate assembly (120) and coupling to the ground lead (102) and a second conductive material (110) is affixed to the second opposite side (124) of the connector substrate assembly (112) coupling the signal lead (114).
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: December 2, 1997
    Assignee: Motorola, Inc.
    Inventors: Raymond Dikun, Dennis Burrell, David M. Dickirson
  • Patent number: 5219292
    Abstract: A printed circuit substrate interconnection is made between two printed circuit substrates. A first printed circuit substrate (10) is a laminate of at least two dielectric layers (12, 14), and has a first circuit pattern (16) disposed between the two layers. The circuit pattern terminates in one or more lands or pads (17) located near a vertical edge (13) of the layer. The second dielectric layer is laminated to the first layer, over the circuit pattern, so as to reveal the lands. A second printed circuit substrate (20) is a laminate of at least one dielectric layer (22), and has a second circuit pattern (26) terminating in one or more lands or pads (27) located near a vertical edge (23) of the layer, and in a pattern corresponding to the lands of the first circuit pattern.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: June 15, 1993
    Assignee: Motorola, Inc.
    Inventors: David M. Dickirson, Ralph E. Digiacomo, Jr.
  • Patent number: 5145382
    Abstract: An electrical socket (10) for interconnecting a printed circuit surface (11) and a coaxial connector (12), comprising a molded plateable dielectric body (10'). The body (10') has a plated center contact portion (20) for selectively receiving the coaxial connector (12) and surface mounting with the printed circuit surface (11). Similarly, the body (10') also has a plated ground contact portion (21) for selectively receiving the coaxial connector (12) and surface mounting with the printed circuit surface (11), wherein the portions are integrally formed as a single piece (10').
    Type: Grant
    Filed: November 29, 1991
    Date of Patent: September 8, 1992
    Assignee: Motorola, Inc.
    Inventor: David M. Dickirson
  • Patent number: D361332
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: August 15, 1995
    Assignee: Motorola, Inc.
    Inventors: William J. Scheid, David M. Dickirson