Patents by Inventor David M. Eaves

David M. Eaves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic circuit ring for BCB WSA circuits
    Patent number: 8598465
    Abstract: A wafer-scale assembly circuit including a plurality of metal interconnect layers, where each metal layer includes patterned metal portions and where at least some of the patterned metal portions are RF signal lines. The circuit further includes at least one benzocyclobutene layer provided between two metal interconnect layers that includes at least one trench via formed around a perimeter of the benzocyclobutene layer at a circuit sealing ring, where the trench via provides a hermetic seal at the sealing ring. The benzocyclobutene layer also includes a plurality of stabilizing post vias formed through the benzocyclobutene layer adjacent to the trench via proximate to the sealing ring and extending around the perimeter of the benzocyclobutene layer, where the stabilizing vias operate to prevent the benzocyclobutene layer from shrinking in size.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: December 3, 2013
    Assignee: Northrop Grumman Systems Corporation
    Inventors: David M. Eaves, Xiang Zeng, Kelly J. Hennig, Patty Pei-Ling Chang-Chien
  • HERMETIC CIRCUIT RING FOR BCB WSA CIRCUITS
    Publication number: 20120193133
    Abstract: A wafer-scale assembly circuit including a plurality of metal interconnect layers, where each metal layer includes patterned metal portions and where at least some of the patterned metal portions are RF signal lines. The circuit further includes at least one benzocyclobutene layer provided between two metal interconnect layers that includes at least one trench via formed around a perimeter of the benzocyclobutene layer at a circuit sealing ring, where the trench via provides a hermetic seal at the sealing ring. The benzocyclobutene layer also includes a plurality of stabilizing post vias formed through the benzocyclobutene layer adjacent to the trench via proximate to the sealing ring and extending around the perimeter of the benzocyclobutene layer, where the stabilizing vias operate to prevent the benzocyclobutene layer from shrinking in size.
    Type: Application
    Filed: January 27, 2011
    Publication date: August 2, 2012
    Applicant: Northrop Grumman Systems Corporation
    Inventors: David M. Eaves, Xiang Zeng, Kelly J. Hennig, Patty Chang-Chien