Abstract: A laser system comprises a pump diode, fiber, relay optics, and a microchip laser crystal. The pump diode produces light at a first wavelength. The fiber receives the light from the pump diode and produces a round, homogeneous light spot at an output of the fiber. The relay optics receives the light from the fiber. The microchip laser crystal receives the light from the relay optics and produces a linearly polarized single frequency output at a second wavelength. The microchip laser crystal includes a first layer and a second layer. The first layer absorbs the light at the first wavelength and emits light at the second wavelength. The second layer receives the light at the second wavelength and either provides a polarization dependent loss at the second wavelength or maintains a polarization of the light at the second wavelength.

Abstract: A laser includes a pump source that provides pump energy at a first wavelength and a laser cavity. The laser cavity includes a laser gain medium that receives the pump energy from the pump source and creates gain at a second wavelength different from the first wavelength, and a mode stripping portion coupled to the laser gain medium. The mode stripping portion causes the laser cavity to have a low Fresnel number so as to allow only the lowest-order fiber mode to resonate in the laser cavity. Higher-order fiber modes are discriminated against so as to generate a laser output having a substantially diffraction limited beam in a single transverse mode at the second wavelength.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A laser includes a pump source that provides pump energy at a first wavelength and a laser cavity. The laser cavity includes a laser gain medium that receives the pump energy from the pump source and creates gain at a second wavelength different from the first wavelength, and a mode stripping portion coupled to the laser gain medium. The mode stripping portion causes the laser cavity to have a low Fresnel number so as to allow only the lowest-order fiber mode to resonate in the laser cavity. Higher-order fiber modes are discriminated against so as to generate a laser output having a substantially diffraction limited beam in a single transverse mode at the second wavelength.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A planar core and a cladding disposed on opposite sides of thereof. In the best mode, the rotator includes a very low Numerical Aperture (NA) planar waveguide. The cladding is birefringent and the refractive index and birefringence thereof are optimized to provide equal mode propagation velocities for both TE and TM modes for at least one transverse mode. The refractive index and birefringence of the cladding are optimized to provide equal mode propagation velocities for both TE and TM modes for a wide range of transverse modes.

Abstract: A planar waveguide with a glass core and a crystalline cladding. In a specific embodiment, the core is doped preferably with Neodymium, Ytterbium, or Erbium. In the best mode, the core is athermal glass with a refractive index uniformity 10?6 or better and the crystalline cladding has a refractive index lower than that of the core by 10?4 to 10?3 with a refractive index uniformity of 10?4. The cladding has high transparency at pump and lasing wavelengths. The coefficient of thermal expansion of the cladding is close to that of the core. In illustrative embodiments, the cladding is Sapphire and the core is aluminate glass. In an alternative embodiment, the cladding is crystal quartz and the core—is phosphate glass. By utilizing different materials for the core and cladding, the properties of each are optimized.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A system and method for providing a wavefront corrected high-energy beam of electromagnetic energy. In the illustrative embodiment, the system includes a source of a first beam of electromagnetic energy; an amplifier for amplifying said beam to provide a second beam; a sensor for sensing aberration in said second beam and providing an error signal in response thereto; a processor for processing said error signal and providing a correction signal in response thereto; and a spatial light modulator responsive to said correction signal for adjusting said beam to facilitate a correction of said aberration thereof. In more specific embodiments, the source is a laser and the sensor is a laser wavefront sensor. A mirror is disposed between said modulator and said sensor for sampling said beam. The mirror has an optical thin-film dielectric coating on at least one optical surface thereof. The coating is effective to sample said beam and transmit a low power sample thereof to said means for sensing aberration.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A laser resonator for generating a laser beam having beam quality along two transverse axes that is determined primarily by the mode discrimination characteristics of one axis. The apparatus including a means for providing a collimated beam of electromagnetic energy with a predetermined orientation with respect to a line of sight thereof, and, a means for rotating the beam such that a transverse mode selection therefor is the same for two orthogonal directions thereof.

Abstract: Laser processing methods, systems and apparatus having a super-modulating power supply or pumping subsystem and high beam quality (i.e., brightness) are disclosed. The methods, systems and apparatus have significant benefits, improved operation characteristics and material processing capability over currently available methods, systems and apparatus. In at least one embodiment, the beam quality of a high power solid state laser is improved in the presence of thermal lensing. High power laser cutting, scribing, and welding results are improved with a combination of modulation and high beam quality while providing for improved processing speeds.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100 W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: Laser processing methods, systems and apparatus having a super-modulating power supply (6) or pumping subsystem (5) and high beam quality (i.e., brightness) are disclosed. The methods, systems and apparatus have significant benefits, improved operation characteristics and material processing capability over currently available methods, systems and apparatus. In at least one embodiment, the beam quality of a high power solid state laser (2) is improved in the presence of thermal lensing. High power laser cutting, scribing, and welding results are improved with a combination of modulation and high beam quality while providing for improved processing speeds.

Abstract: A waveguide device in the form of either a solid-state laser or amplifier is divided into separate pumping and output mode control sections along at least one direction of the device by leaving a portion of a core of the device unclad or by depositing appropriate coatings on different sections of the core or by contacting/bonding materials with different refractive indices to different sections of the core or by a combination of these approaches. The core has a pump input surface for receiving pumping radiation at a pumping wavelength and one or more output surfaces for emitting a laser beam at an output wavelength. When used as an amplifier, the core also has a laser input surface which may be the same as one of the output surfaces.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.