Patents by Inventor David M. McNamara

David M. McNamara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9435882
    Abstract: A method and apparatus for cognitive non-linear radar processing comprising identifying one or more frequency bands of interest, passively scanning, using a non-linear radar (NR), the one or more frequency bands of interest to determine whether interference signals are occupying the one or more bands, transmitting radar waveforms and receiving radar waveform responses at one or more frequency bands determined to be free of interference, determining a likelihood of a target being present or not based on whether the received waveform responses match stored waveform responses for non-linear targets, and modifying waveform parameters of the transmitted radar waveform when the received waveform responses match the stored waveform responses, so as to transmit a modified radar waveform.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: September 6, 2016
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Anthony F. Martone, David M. McNamara, Gregory J. Mazzaro, Abigail S. Hedden
  • Patent number: 9419360
    Abstract: Mating interfaces for an electrical connector are provided. In some embodiments, a mating interface comprises: a plurality of conductive elements positioned in a plurality of columns, each of the plurality of conductive elements comprising: a sheet of conductive material formed into a three dimensional structure such that the conductive material is disposed on at least two sides of an opening adapted to receive a mating conductive element; and at least one tab cut in the sheet, the at least one tab comprising a mating contact surface facing the opening and adapted to make contact to the mating conductive element.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: August 16, 2016
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, David M. McNamara, John Robert Dunham, Michael Joseph Snyder
  • Publication number: 20160033622
    Abstract: A method and apparatus for cognitive non-linear radar processing comprising identifying one or more frequency bands of interest, passively scanning, using a non-linear radar (NR), the one or more frequency bands of interest to determine whether interference signals are occupying the one or more bands, transmitting radar waveforms and receiving radar waveform responses at one or more frequency bands determined to be free of interference, determining a likelihood of a target being present or not based on whether the received waveform responses match stored waveform responses for non-linear targets, and modifying waveform parameters of the transmitted radar waveform when the received waveform responses match the stored waveform responses, so as to transmit a modified radar waveform.
    Type: Application
    Filed: August 27, 2013
    Publication date: February 4, 2016
    Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I
    Inventors: Anthony F. Martone, David M. McNamara, Gregory J. Mazzaro, Abigail S. Hedden
  • Patent number: 8801464
    Abstract: A two-piece mezzanine connector for high speed, high density signals. One piece of the connector may have conductive elements with beam-shaped mating contacts. The beams may include openings to control mechanical properties while allowing edge to edge spacing between adjacent beams to be selected to provide desired electrical properties. The openings may be teardrop shaped, with a larger width at a distal end of the beams. Beams associated with signal conductors may have openings that are shaped differently from openings of beams associated with ground conductors. For a first connector piece, mating contact regions of signal conductors may be wider than mating contact regions of ground conductors. For a second connector piece adapted to mate with the first connector piece, mating contact regions of signal conductors may be narrower than mating contact regions of ground conductors. These contact shapes may provide float while maintaining a high contact density.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: August 12, 2014
    Assignee: Amphenol Corporation
    Inventors: David M. McNamara, Brian Kirk
  • Patent number: 8657627
    Abstract: A two-piece mezzanine connector for high speed, high density signals. The connector is assembled from wafers that may be formed of identical wafer halves. The halves may have interior portions that form a channel in which a lossy member may be captured for selectively configuring the connector for high frequency performance. The lossy member may be serpentine, to both provide different spacing relative to signal and ground conductors and to provide compliance to press against ground conductors when captured between wafer halves. Instead of, or in addition to, the lossy member captured between two wafer halves, the wafer halves may each have lossy material overmolded on at least one side, so that an assembled wafer may have lossy material disposed on the outside. The wafers may have dovetail projections that are secured within dovetail channels, forming structural members of the connector.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: February 25, 2014
    Assignee: Amphenol Corporation
    Inventors: David M. McNamara, Brian Kirk
  • Patent number: 8636543
    Abstract: A footprint of an electronic assembly formed from conductive pads on a surface of a printed circuit board. One or more vias may connect each pad to a conductive structure within the printed circuit board. The footprint may be such that the vias for the pads are aligned along columns, leaving wide routing channels between the columns. The pads may have different shapes. For example, some of the pads may each have two solder attachment regions that are electrically connected to a ground plane, while other pads may each have one solder attachment region that is electrically connected to a signal trace. The solder attachment regions may be arranged in such a pattern that they align with respective contact tails of a connector assembly. A signal path may be formed between a solder attachment region and a corresponding contact tail through a solder ball attached to the contact tail.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: January 28, 2014
    Assignee: Amphenol Corporation
    Inventor: David M. McNamara
  • Publication number: 20130288529
    Abstract: A two-piece mezzanine connector for high speed, high density signals. One piece of the connector may have conductive elements with beam-shaped mating contacts. The beams may include openings to control mechanical properties while allowing edge to edge spacing between adjacent beams to be selected to provide desired electrical properties. The openings may be teardrop shaped, with a larger width at a distal end of the beams. Beams associated with signal conductors may have openings that are shaped differently from openings of beams associated with ground conductors. For a first connector piece, mating contact regions of signal conductors may be wider than mating contact regions of ground conductors. For a second connector piece adapted to mate with the first connector piece, mating contact regions of signal conductors may be narrower than mating contact regions of ground conductors. These contact shapes may provide float while maintaining a high contact density.
    Type: Application
    Filed: June 18, 2013
    Publication date: October 31, 2013
    Inventors: David M. McNamara, Brian Kirk
  • Patent number: 8491313
    Abstract: A two-piece mezzanine connector for high speed, high density signals. One piece of the connector may have conductive elements with beam-shaped mating contacts. The beams may include openings to control mechanical properties while allowing edge to edge spacing between adjacent beams to be selected to provide desired electrical properties. The openings may be teardrop shaped, with a larger width at a distal end of the beams. Beams associated with signal conductors may have openings that are shaped differently from openings of beams associated with ground conductors. For a first connector piece, mating contact regions of signal conductors may be wider than mating contact regions of ground conductors. For a second connector piece adapted to mate with the first connector piece, mating contact regions of signal conductors may be narrower than mating contact regions of ground conductors. These contact shapes may provide float while maintaining a high contact density.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: July 23, 2013
    Assignee: Amphenol Corporation
    Inventors: David M. McNamara, Brian Kirk
  • Publication number: 20120202387
    Abstract: A footprint of an electronic assembly formed from conductive pads on a surface of a printed circuit board. One or more vias may connect each pad to a conductive structure within the printed circuit board. The footprint may be such that the vias for the pads are aligned along columns, leaving wide routing channels between the columns. The pads may have different shapes. For example, some of the pads may each have two solder attachment regions that are electrically connected to a ground plane, while other pads may each have one solder attachment region that is electrically connected to a signal trace. The solder attachment regions may be arranged in such a pattern that they align with respective contact tails of a connector assembly. A signal path may be formed between a solder attachment region and a corresponding contact tail through a solder ball attached to the contact tail.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 9, 2012
    Applicant: Amphenol Corporation
    Inventor: David M. McNamara
  • Publication number: 20120202363
    Abstract: A two-piece mezzanine connector for high speed, high density signals. The connector is assembled from wafers that may be formed of identical wafer halves. The halves may have interior portions that form a channel in which a lossy member may be captured for selectively configuring the connector for high frequency performance. The lossy member may be serpentine, to both provide different spacing relative to signal and ground conductors and to provide compliance to press against ground conductors when captured between wafer halves. Instead of, or in addition to, the lossy member captured between two wafer halves, the wafer halves may each have lossy material overmolded on at least one side, so that an assembled wafer may have lossy material disposed on the outside. The wafers may have dovetail projections that are secured within dovetail channels, forming structural members of the connector.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 9, 2012
    Applicant: Amphenol Corporation
    Inventors: David M. McNamara, Brian Kirk
  • Publication number: 20120202386
    Abstract: A two-piece mezzanine connector for high speed, high density signals. One piece of the connector may have conductive elements with beam-shaped mating contacts. The beams may include openings to control mechanical properties while allowing edge to edge spacing between adjacent beams to be selected to provide desired electrical properties. The openings may be teardrop shaped, with a larger width at a distal end of the beams. Beams associated with signal conductors may have openings that are shaped differently from openings of beams associated with ground conductors. For a first connector piece, mating contact regions of signal conductors may be wider than mating contact regions of ground conductors. For a second connector piece adapted to mate with the first connector piece, mating contact regions of signal conductors may be narrower than mating contact regions of ground conductors. These contact shapes may provide float while maintaining a high contact density.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 9, 2012
    Applicant: Amphenol Corporation
    Inventors: David M. McNamara, Brian Kirk
  • Patent number: 6641410
    Abstract: An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: November 4, 2003
    Assignee: Teradyne, Inc.
    Inventors: Edward G. Marvin, David M. McNamara
  • Patent number: 6537087
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: March 25, 2003
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Edward Gerald Marvin
  • Patent number: 6530790
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: March 11, 2003
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Sepehr Kiani, William E. Howard, Philip Stokoe, Edward Gerald Marvin
  • Publication number: 20020187688
    Abstract: An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.
    Type: Application
    Filed: June 7, 2001
    Publication date: December 12, 2002
    Inventors: Edward G. Marvin, David M. McNamara
  • Publication number: 20020098727
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Application
    Filed: January 25, 2002
    Publication date: July 25, 2002
    Applicant: Teradyne, Inc.
    Inventors: David M. McNamara, Sepehr Kiani, William E. Howard, Philip Stokoe, Edward Gerald Marvin
  • Patent number: 6394822
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: May 28, 2002
    Assignee: Teradyne, Inc.
    Inventor: David M. McNamara
  • Patent number: 6299483
    Abstract: A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: October 9, 2001
    Assignee: Teradyne, Inc.
    Inventors: Thomas S. Cohen, Philip T. Stokoe, David M. McNamara
  • Publication number: 20010005654
    Abstract: A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields.
    Type: Application
    Filed: January 5, 2001
    Publication date: June 28, 2001
    Applicant: Teradyne, Inc.
    Inventors: Thomas S. Cohen, Philip T. Stokoe, David M. McNamara
  • Patent number: 6152747
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: November 28, 2000
    Assignee: Teradyne, Inc.
    Inventor: David M. McNamara