Abstract: Systems and methods of characterizing wafer shape using coherent gradient sensing (CGS) interferometry are disclosed. The method includes measuring at least 3×106 data points on a wafer surface using a CGS system to obtain a topography map of the wafer surface. The data are collected on a wafer for pre-processing and post-processing of the wafer, and the difference calculated to obtain a measurement of the effect of the process on wafer surface shape. The process steps for processing the same wafer or subsequent wafers are controlled based on measured process-induced change in the wafer surface shape in order to improve the quality of the wafer processing.

Abstract: Full-wafer inspection methods for a semiconductor wafer are disclosed. One method includes making a measurement of a select measurement parameter simultaneously over measurement sites of the entire surface of the semiconductor wafer at a maximum measurement-site pixel density ?max to obtain measurement data, wherein the total number of measurement-site pixels obtained at the maximum measurement-site pixel density ?max is between 104 and 108. The method also includes defining a plurality of zones of the surface of the semiconductor wafer, with each of the zones having a measurement-site pixel density ?, with at least two of the zones having a different sized measurement-site pixel and thus a different measurement-site pixel density ?. The method also includes processing the measurement data based on the plurality of zones and the corresponding measurement-site pixel densities ?.

Abstract: Systems and methods of characterizing wafer shape using coherent gradient sensing (CGS) interferometry are disclosed. The method includes measuring at least 3×106 data points on a wafer surface using a CGS system to obtain a topography map of the wafer surface. The data are collected on a wafer for pre-processing and post-processing of the wafer, and the difference calculated to obtain a measurement of the effect of the process on wafer surface shape. The process steps for processing the same wafer or subsequent wafers are controlled based on measured process-induced change in the wafer surface shape in order to improve the quality of the wafer processing.

Abstract: Methods are provided for diagnosing and treating or preventing keratinocyte-derived lesions, e.g., SCC, (including high-risk forms), non-melanoma skin cancers (including high-risk forms), and actinic keratinosis (“AK”) by administering a therapeutically effective amount of camphor oil, camphor oil derivatives or components, and certain terpene TRPV3 agonists including 2-APB.

Abstract: Systems and techniques for integrating an optical coherent gradient sensing (CGS) module and another optical sensing module to simultaneously measure the curvature and another property of a specularly reflective surface.

Abstract: Systems and techniques for integrating an optical coherent gradient sensing (CGS) module and another optical sensing module to simultaneously measure the curvature and another property of a specularly reflective surface.

Abstract: A therapeutic chew device for aiding against periodontal disease in dogs which includes a length of rope formed of a plurality of polyester yarns with knots near the opposite ends of the rope and a chewable rawhide disk, including a compressed rawhide chew impregnated with activated charcoal, attached to the length of rope between the two knot. As the dog chews on the rope, the plurality of polyester yarns massage and stimulate the gums while individual loose yarn ends provide cleaning and flossing action for the teeth. In addition, as the dog chews on the charcoal impregnated rawhide disk, the activated charcoal is slowly released and absorbs odors and bacteria to clean and freshen the dog's breath.