Patents by Inventor David M. Sellepack

David M. Sellepack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020109256
    Abstract: A three dimensional structure, such as a watercraft, and a method for forming the three dimensional polymeric structure are described. The method includes providing at least one paint layer and a bonding layer coupled to the at least one paint layer and including a first exterior surface, extruding a structural sheet of at least one polymeric material at an extrusion temperature, wherein the sheet has a thickness of at least 0.25 inches and a second exterior surface, joining the first exterior surface to the second exterior surface to form a thermoformable sheet, forcing the thermoformable sheet against a three dimensional mold while the sheet is at a thermoformable temperature to deform the sheet into a three dimensional structure and removing the three dimensional structure from the mold.
    Type: Application
    Filed: July 11, 2001
    Publication date: August 15, 2002
    Inventor: David M. Sellepack
  • Publication number: 20020109251
    Abstract: A method for forming a three dimensional polymeric structure includes providing at least one paint layer and providing a bonding layer coupled to the at least one paint layer to form an insert having a bonding surface provided by the bonding layer. A mold having a hollow interior bounded by an interior surface is further provided. The insert is positioned within the interior along a portion of the interior surface. At least one charge of thermoplastic material is deposited into the interior. The interior is heated while the mold is rotated and rocked. As a result, the thermoplastic material melts and is deposited against the interior surface of the mold and against the bonding surface of the insert to form a three dimensional structure within the interior. The three dimensional structure is then removed from the interior of the mold.
    Type: Application
    Filed: July 11, 2001
    Publication date: August 15, 2002
    Inventor: David M. Sellepack