Patents by Inventor David Maccarone
David Maccarone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9048646Abstract: An electrical box extender includes a rectangular tube having a first pair of opposing sides and a second pair of opposing sides. The first pair of opposing sides and the second pair of opposing sides form a perimeter configured to fit within a single-gang electrical box. The electrical box extender also includes a set of flanges extending laterally from a front edge of the first pair of opposing sides. The set of flanges includes a male interlocking flange and a female interlocking flange. The male interlocking flange is configured to attach to another female interlocking flange of a substantially identical electrical box extender.Type: GrantFiled: September 11, 2012Date of Patent: June 2, 2015Assignee: Thomas & Betts International, Inc.Inventor: David Maccarone
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Publication number: 20130098653Abstract: An electrical box extender includes a rectangular tube having a first pair of opposing sides and a second pair of opposing sides. The first pair of opposing sides and the second pair of opposing sides form a perimeter configured to fit within a single-gang electrical box. The electrical box extender also includes a set of flanges extending laterally from a front edge of the first pair of opposing sides. The set of flanges includes a male interlocking flange and a female interlocking flange. The male interlocking flange is configured to attach to another female interlocking flange of a substantially identical electrical box extender.Type: ApplicationFiled: September 11, 2012Publication date: April 25, 2013Applicant: THOMAS & BETTS INTERNATIONAL, INC.Inventor: David Maccarone
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Patent number: 7078616Abstract: A small round floor box installs through a two inch diameter hole in a floor to provide a small footprint that improves the appearance of the installation and makes it less obtrusive. The box accommodates a single power receptacle or data plugs that attach to mounting plates that snap connect within the box.Type: GrantFiled: September 24, 2004Date of Patent: July 18, 2006Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Dennis P. Revlock, Sr.
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Publication number: 20060065420Abstract: A small round floor box installs through a two inch diameter hole in a floor to provide a small footprint that improves the appearance of the installation and makes it less obtrusive. The box accommodates a single power receptacle or data plugs that attach to mounting plates that snap connect within the box.Type: ApplicationFiled: September 24, 2004Publication date: March 30, 2006Inventors: Mark Roesch, David Maccarone, Dennis Revlock
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Patent number: 6423897Abstract: An electrical utility box is configured to contain an electrical device. The box includes a bottom wall, two opposing side walls, two opposing end walls, a mounting boss, and a shield structure. The mounting boss has a bore configured to receive a fastener that fastens the electrical device to the box. The shielding structure is configured to block an uninsulated wire from contacting a portion of the fastener that protrudes from an open lower end of the bore.Type: GrantFiled: July 26, 2000Date of Patent: July 23, 2002Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone
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Patent number: 6004417Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.Type: GrantFiled: January 20, 1998Date of Patent: December 21, 1999Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
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Patent number: 5922798Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.Type: GrantFiled: January 20, 1998Date of Patent: July 13, 1999Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom
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Patent number: 5877236Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.Type: GrantFiled: January 20, 1998Date of Patent: March 2, 1999Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
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Patent number: 5824724Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.Type: GrantFiled: January 20, 1998Date of Patent: October 20, 1998Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
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Patent number: 5821293Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.Type: GrantFiled: October 29, 1996Date of Patent: October 13, 1998Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
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Patent number: D443863Type: GrantFiled: August 30, 2000Date of Patent: June 19, 2001Assignee: The Lamson & Sessions Co.Inventors: David A. Maccarone, Jeffrey S. Parker
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Patent number: D459312Type: GrantFiled: September 5, 2001Date of Patent: June 25, 2002Assignee: The Lamson & Sessions Co.Inventors: Mark A. Roesch, David A. Maccarone, Dennis P. Revlock, Sr.