Patents by Inventor David Maccarone

David Maccarone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9048646
    Abstract: An electrical box extender includes a rectangular tube having a first pair of opposing sides and a second pair of opposing sides. The first pair of opposing sides and the second pair of opposing sides form a perimeter configured to fit within a single-gang electrical box. The electrical box extender also includes a set of flanges extending laterally from a front edge of the first pair of opposing sides. The set of flanges includes a male interlocking flange and a female interlocking flange. The male interlocking flange is configured to attach to another female interlocking flange of a substantially identical electrical box extender.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: June 2, 2015
    Assignee: Thomas & Betts International, Inc.
    Inventor: David Maccarone
  • Publication number: 20130098653
    Abstract: An electrical box extender includes a rectangular tube having a first pair of opposing sides and a second pair of opposing sides. The first pair of opposing sides and the second pair of opposing sides form a perimeter configured to fit within a single-gang electrical box. The electrical box extender also includes a set of flanges extending laterally from a front edge of the first pair of opposing sides. The set of flanges includes a male interlocking flange and a female interlocking flange. The male interlocking flange is configured to attach to another female interlocking flange of a substantially identical electrical box extender.
    Type: Application
    Filed: September 11, 2012
    Publication date: April 25, 2013
    Applicant: THOMAS & BETTS INTERNATIONAL, INC.
    Inventor: David Maccarone
  • Patent number: 7078616
    Abstract: A small round floor box installs through a two inch diameter hole in a floor to provide a small footprint that improves the appearance of the installation and makes it less obtrusive. The box accommodates a single power receptacle or data plugs that attach to mounting plates that snap connect within the box.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: July 18, 2006
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Dennis P. Revlock, Sr.
  • Publication number: 20060065420
    Abstract: A small round floor box installs through a two inch diameter hole in a floor to provide a small footprint that improves the appearance of the installation and makes it less obtrusive. The box accommodates a single power receptacle or data plugs that attach to mounting plates that snap connect within the box.
    Type: Application
    Filed: September 24, 2004
    Publication date: March 30, 2006
    Inventors: Mark Roesch, David Maccarone, Dennis Revlock
  • Patent number: 6423897
    Abstract: An electrical utility box is configured to contain an electrical device. The box includes a bottom wall, two opposing side walls, two opposing end walls, a mounting boss, and a shield structure. The mounting boss has a bore configured to receive a fastener that fastens the electrical device to the box. The shielding structure is configured to block an uninsulated wire from contacting a portion of the fastener that protrudes from an open lower end of the bore.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: July 23, 2002
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone
  • Patent number: 6004417
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 21, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5922798
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: July 13, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom
  • Patent number: 5877236
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: March 2, 1999
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5824724
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: October 20, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: 5821293
    Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: October 13, 1998
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Gary F. Hillenbrand, Morris F. Newsom, Roland M. Lynch
  • Patent number: D443863
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: June 19, 2001
    Assignee: The Lamson & Sessions Co.
    Inventors: David A. Maccarone, Jeffrey S. Parker
  • Patent number: D459312
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: June 25, 2002
    Assignee: The Lamson & Sessions Co.
    Inventors: Mark A. Roesch, David A. Maccarone, Dennis P. Revlock, Sr.