Patents by Inventor David Manero

David Manero has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-Finish Printed Circuit Board
    Publication number: 20140231127
    Abstract: A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (HASL) surface finish or a lead-free hot air solder leveling (LF HASL) surface finish and the second surface finish may be an organic surface protector (OSP) surface finish. The second surface finish may be applied to one or more electrically conductive elements from which the first surface finish was removed.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 21, 2014
    Applicant: LUTRON ELECTRONICS CO., INC.
    Inventor: David Manero