Abstract: A force sensor assembly includes stress isolation features/geometry that blocks out unintended/off-axis forces/stress that would normally create an inaccurate force output. The force sensor assembly is a relatively low cost, high volume, weight minimizing design using robust automotive grade technology and is easily integrated into various applications due to a platform design approach. The piezoresistive MEMS are placed on stainless steel, which are minimized to allow for mass/cost reduction, therefore the other parts (PCB, element cover, customizable force bar) in the assembly are also minimized to allow for mass/cost reduction. The assembly is a simple 3-piece assembly that is easily integrated with minimal assembly processes. The automotive grade technology referenced is high pressure piezoresistive MEMS technology.

Abstract: An automotive electronic device includes a pocket, which houses electronic components, bond wires connecting the electronic components, and a protective gel to encapsulate the electronic components and bond wires. A pocket cover has fins that protrude into the gel to reduce vibration of the gel and reduce vibration fatigue failure of the bond wires. The fins may: divide the gel into a plurality of cells; reduce the width of cells perpendicular to the bond wires; protrude deeper into the gel than the bond wires; and/or have differing shapes and/or depths.

Abstract: An automotive electronic device includes a pocket, which houses electronic components, bond wires connecting the electronic components, and a protective gel to encapsulate the electronic components and bond wires. A pocket cover has fins that protrude into the gel to reduce vibration of the gel and reduce vibration fatigue failure of the bond wires. The fins may: divide the gel into a plurality of cells; reduce the width of cells perpendicular to the bond wires; protrude deeper into the gel than the bond wires; and/or have differing shapes and/or depths.

Abstract: A piezoresistive pressure sensor that uses a protective gel to protect the piezoresistive device is susceptible to lead wire failure by vibration-induced waves in the protective gel. Such waves can be reduced and the device made more robust by the use of three-dimensional structures in the gel, which are configured to reduce and/or re-direct vibration-induced pressure waves in the gel. The structures are referred to as “breakwaters” in that they protect lead wires and lead wire connections from wave fronts and the damage that wave-induced pressure on the lead wires causes.

Abstract: A piezoresistive pressure sensor that uses a protective gel to protect the piezoresistive device is susceptible to lead wire failure by vibration-induced waves in the protective gel. Such waves can be reduced and the device made more robust by the use of three-dimensional structures in the gel, which are configured to reduce and/or re-direct vibration-induced pressure waves in the gel. The structures are referred to as “breakwaters” in that they protect lead wires and lead wire connections from wave fronts and the damage that wave-induced pressure on the lead wires causes.