Patents by Inventor David Manter

David Manter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9509101
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: November 29, 2016
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 9450344
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: September 20, 2016
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20160149343
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Application
    Filed: November 20, 2015
    Publication date: May 26, 2016
    Applicant: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Patent number: 9225085
    Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: December 29, 2015
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., David Manter, Prescott B. Atkinson, Philip T. Stokoe, Thomas S. Cohen, Mark W. Gailus
  • Patent number: 9219335
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: December 22, 2015
    Assignee: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Publication number: 20150236452
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: January 22, 2015
    Publication date: August 20, 2015
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20150236451
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: January 22, 2015
    Publication date: August 20, 2015
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Patent number: 9022806
    Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 5, 2015
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., David Manter, Prescott B. Atkinson, Philip T. Stokoe, Thomas S. Cohen, Mark W. Gailus
  • Publication number: 20150056856
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Application
    Filed: August 28, 2014
    Publication date: February 26, 2015
    Applicant: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Patent number: 8864521
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: October 21, 2014
    Assignee: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Publication number: 20140004746
    Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 2, 2014
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., David Manter, Prescott B. Atkinson, Philip T. Stokoe, Thomas S. Cohen, Mark W. Gailus
  • Publication number: 20140004726
    Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 2, 2014
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., David Manter, Prescott B. Atkinson, Philip T. Stokoe, Thomas S. Cohen, Mark W. Gailus
  • Publication number: 20140004724
    Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 2, 2014
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., David Manter, Prescott B. Atkinson, Philip T. Stokoe, Thomas S. Cohen, Mark W. Gailus
  • Publication number: 20110230095
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Application
    Filed: February 16, 2011
    Publication date: September 22, 2011
    Applicant: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Patent number: 7794278
    Abstract: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: September 14, 2010
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Brian Kirk, Jason E. Chan, Andreas C. Pfahnl, Marc B. Cartier, Jr., David Manter
  • Patent number: 7494383
    Abstract: An electrical connector suitable for use in an adapter. The connector includes conductive elements that can be routed in three dimensions to facilitate interconnections between connectors used to form an adapter. Simplified construction is achieved through use of connector wafers, each of which route signals in a plane such that when the wafers are organized side-by-side in a connector, signals may be routed through multiple parallel planes. Some of the wafers may include holes through which conductive elements from other wafers may pass, to that signal may be routed in a third dimension, perpendicular to the parallel planes. The adapter may be mounted on a printed circuit board or other substrate with active components. Signals may pass through the adapter in one of the parallel planes or may be routed for conditioning in the active components.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: February 24, 2009
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, David Manter
  • Publication number: 20090029602
    Abstract: An electrical connector suitable for use in an adapter. The connector includes conductive elements that can be routed in three dimensions to facilitate interconnections between connectors used to form an adapter. Simplified construction is achieved through use of connector wafers, each of which route signals in a plane such that when the wafers are organized side-by-side in a connector, signals may be routed through multiple parallel planes. Some of the wafers may include holes through which conductive elements from other wafers may pass, to that signal may be routed in a third dimension, perpendicular to the parallel planes. The adapter may be mounted on a printed circuit board or other substrate with active components. Signals may pass through the adapter in one of the parallel planes or may be routed for conditioning in the active components.
    Type: Application
    Filed: July 23, 2007
    Publication date: January 29, 2009
    Inventors: Thomas S. Cohen, David Manter
  • Publication number: 20080248658
    Abstract: An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
    Type: Application
    Filed: April 4, 2008
    Publication date: October 9, 2008
    Inventors: Thomas S. Cohen, Brian Kirk, Jason E. Chan, Andreas C. Pfahnl, Marc B. Cartier, David Manter
  • Publication number: 20070042639
    Abstract: An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction.
    Type: Application
    Filed: June 29, 2006
    Publication date: February 22, 2007
    Inventors: David Manter, Thomas Cohen