Patents by Inventor David Martin Peck

David Martin Peck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymeric adhesive paste
    Patent number: 6140402
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: October 31, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck
  • Polymeric adhesive paste
    Patent number: 6111005
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: August 29, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck