Abstract: Systems, devices, and technical methods of the present disclosure use an edge appliance to facilitate seamless interoperability between a cloud emergency call management system and call-center systems that are situated onsite in an emergency call center. When an emergency call is received from a caller device, the CECMS routes the call to a call taker who may be working remotely on a telecommunication device. The CECMS transmits a duplicate of audio data and other data that is exchanged between the caller device and the telecommunication device during the call to the edge appliance. The edge appliance converts the audio data and the other data into formats that are compatible with the call-center systems and uses a virtual construct that represents the telecommunication device to transmit the converted data to the call-center systems through a network to which both the edge appliance and the call-center systems are connected.

Abstract: Systems and methods for managing smart devices associated with a multi-family residential property are disclosed. Control or management of smart devices may be provided by a smart thermostat hub that includes one or more processors and a memory coupled to the one or more processors. The smart thermostat hub also includes a first communication interface configured to communicatively couple the smart thermostat hub to a low-power, wide area network (LPWAN) communication link and a second communication interface configured to communicatively couple the smart thermostat hub to a wireless network via a wireless communication link. The wireless network is communicatively coupled to a set of one or more smart devices. The one or more processors are configured to initialize a connection between the second communication interface and the property management platform via the second communication interface.

Abstract: A variable frequency multiplier circuit for frequency multiplying an input signal provided by an ultra-low phase noise signal source includes a tone generator configured to generate a multiple tones from the input signal; a signal separating circuit configured to separate the multiple tones into tones of interest and idler tones, where the tones of interest are separated into one or more groups and outputted from the signal separating circuit, and the idler tones are terminated; an amplification circuit configured to amplify each group of the tones of interest to optimize small and large signal responses; and a switched filter bank configured to selectively connect a selected tone from the tones of interest to a circuit output.

Abstract: A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.

Abstract: A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.