Abstract: Electronic greeting cards include a greeting card with two or more interconnected panels in combination with a digital multimedia player device which includes an electronic display and an audio output, and circuitry which is operative to receive, store and play digital multimedia files and content. The various greeting card structures cover and encapsulate or otherwise house and adorn the digital multimedia player. Digital files are loaded on to the digital multimedia player by a connection to a network, or directly from a data storage device such as an SD card or USB connection or compact flash which interfaces with a port in the digital multimedia player. Pre-recorded digital multimedia greeting card content is either pre-loaded on a portable data storage device, or selected for purchase and downloaded or transferred for replay by the digital multimedia player of the electronic greeting card.

Abstract: Electronic greeting cards include a greeting card with two or more interconnected panels in combination with a digital multimedia player device which includes an electronic display and an audio output, and circuitry which is operative to receive, store and play digital multimedia files and content. The various greeting card structures cover and encapsulate or otherwise house and adorn the digital multimedia player. Digital files are loaded on to the digital multimedia player by a connection to a network, or directly from a data storage device such as an SD card or USB connection or compact flash which interfaces with a port in the digital multimedia player. Pre-recorded digital multimedia greeting card content is either pre-loaded on a portable data storage device, or selected for purchase and downloaded or transferred for replay by the digital multimedia player of the electronic greeting card.

Abstract: Greeting cards and novelties with electronic circuits having switch mechanisms operable by manipulation of a moveable component. Manipulation of the moveable component causes activation of the electronic circuit.

Abstract: Audio or sound envelopes contain or are combined with a sound module for generating and playing prerecorded sound tracks upon the opening of the envelope or removal of its contents. Operation of the sound module may be activated by the opening of the envelope flap, or by removal of the envelope contents. The flap is configured with a removable strip which protects the sound module from damage before and after opening. The sound module can be replayed by repeated operation of the flap. Alternate embodiments of the audio envelopes have other structural or operational features which work in concert with the sound module.

Abstract: Electronic greeting cards include a greeting card with two or more interconnected panels in combination with a digital multimedia player device which includes an electronic display and an audio output, and circuitry which is operative to receive, store and play digital multimedia files and content. The various greeting card structures cover and encapsulate or otherwise house and adorn the digital multimedia player. Digital files are loaded on to the digital multimedia player by a connection to a network, or directly from a data storage device such as an SD card or USB connection or compact flash which interfaces with a port in the digital multimedia player. Pre-recorded digital multimedia greeting card content is either pre-loaded on a portable data storage device, or selected for purchase and downloaded or transferred for replay by the digital multimedia player of the electronic greeting card.

Abstract: A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.

Abstract: Connection structures on an extra-vascular electrode lead body improve strain relief and strengthen the transition region where electrical conductors carried by the lead body are joined to individual electrodes at the distal end of the lead. The electrodes include structure or mechanisms for externally securing the electrode assembly to a body part. A first connection structure is located on the lead body proximal the electrodes to anchor the lead body to a first anchor location in the body that generally moves in concert with the body part. A second connection structure is located on the lead body proximal to the first connection structure to anchor the lead body to a second anchor location that is at least partially independent of movement of the body part. The first and second anchor location are offset by a distance that is less than a distance between the first and second connection structures to provide strain relief for the electrodes.

Abstract: A garment with two improved, underarm perspiration shields each including an inner comfort layer, at least one middle absorbent layer, and an outer water-proof barrier layer. The inner comfort layer is placed against the user's skin and designed to readily absorb perspiration from the skin and immediately transfer it to the middle absorbent layers. The middle absorbent layers draw the perspiration away from the comfort layer and dissipate the perspiration thereover. The outer barrier layer is located on the opposite side of the middle absorbent layers and designed to prevent perspiration from being transferred to the surround garment material. During manufacturing, the layers are aligned, registered, and sewn along their center axis to the garment's side seam. The outer edges of the layers are unattached thereby forming side flaps that are exposed to air and able to dry quickly. The upper edge of each shield may be contoured and sewn to the edge of the garments sleeve opening.

Abstract: A system having a power module mount adapted to support a power module side-by-side with a card-based processor, and a connectivity guide adapted to guide the power module along a direct path between electrically connected and disconnected relationships with the card-based processor. A method for mounting a power module to a processor involving engaging the power module with a connectivity guide disposed adjacent the processor, moving the power module toward the processor via the connectivity guide, and mating edge connectors of the power module and the processor.

Abstract: An electronic device having a processor assembly. The electronic device comprising a first device connectable to the processor assembly a socket assembly adapted to receive the processor assembly, the socket assembly comprising an actuator operable to secure the processor assembly to the socket assembly; and a movable member adapted to prevent the actuator from being operated with the first device connected to the processor assembly An assembly for coupling a processor to an actuatable socket assembly. The assembly comprises a first member adapted to receive the processor and a second member movable relative to the first member. The second member is adapted to prevent the socket assembly from being actuated when the second member is disposed in a first position.

Abstract: A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.

Abstract: Connection structures on an extra-vascular electrode lead body improve strain relief and strengthen the transition region where electrical conductors carried by the lead body are joined to individual electrodes at the distal end of the lead. The electrodes include structure or mechanisms for externally securing the electrode assembly to a body part. A first connection structure is located on the lead body proximal the electrodes to anchor the lead body to a first anchor location in the body that generally moves in concert with the body part. A second connection structure is located on the lead body proximal to the first connection structure to anchor the lead body to a second anchor location that is at least partially independent of movement of the body part. The first and second anchor location are offset by a distance that is less than a distance between the first and second connection structures to provide strain relief for the electrodes.

Abstract: A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.

Abstract: The acoustic noise produced by a set of cooling fans in an electronic system is minimized by determining, for each of a set of operating points, a combination of fan speeds that minimizes the total acoustic noise. The technique may be applied to a variety of electronic systems, including workstations.

Abstract: A rack computer system. In one embodiment, a rack structure having a pair of mounting legs each having a rail interface oriented in a plane transverse to the pair of mounting legs. The rack computer system also has a computer chassis having a pair of mounting rails movable along the rail interface between a plurality of mounting depths oriented along the plane. In another embodiment, a method of forming a versatile rack mount.

Abstract: An apparatus for protecting pins of an integrated circuit comprises a cover member; and at least one securing mechanism for securing the cover member to an assembly that includes at least one integrated circuit having pins, wherein the cover member covers at least the pins.

Abstract: A body compatible stent is formed of multiple filaments arranged in at least two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold working steps.

Abstract: A system having a power module mount adapted to support a power module side-by-side with a card-based processor, and a connectivity guide adapted to guide the power module along a direct path between electrically connected and disconnected relationships with the card-based processor. A method for mounting a power module to a processor involving engaging the power module with a connectivity guide disposed adjacent the processor, moving the power module toward the processor via the connectivity guide, and mating edge connectors of the power module and the processor.

Abstract: An electronic device having a processor assembly. The electronic device comprising a first device connectable to the processor assembly a socket assembly adapted to receive the processor assembly, the socket assembly comprising an actuator operable to secure the processor assembly to the socket assembly; and a movable member adapted to prevent the actuator from being operated with the first device connected to the processor assembly An assembly for coupling a processor to an actuatable socket assembly. The assembly comprises a first member adapted to receive the processor and a second member movable relative to the first member. The second member is adapted to prevent the socket assembly from being actuated when the second member is disposed in a first position.

Abstract: A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices.