Patents by Inventor David McCallum

David McCallum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923617
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 16, 2021
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Publication number: 20190322376
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: February 22, 2019
    Publication date: October 24, 2019
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 10214295
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: February 26, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20170305564
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: May 8, 2017
    Publication date: October 26, 2017
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9650148
    Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 16, 2017
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20170015430
    Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.
    Type: Application
    Filed: April 18, 2016
    Publication date: January 19, 2017
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9315267
    Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: April 19, 2016
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20130285440
    Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: February 15, 2013
    Publication date: October 31, 2013
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20110318866
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film compound solar cell before it is separated from the substrate. To separate the thin film compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film compound solar cell.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 29, 2011
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Glen HILLIER, Duy Phach VU, Rao TATAVARTI, Christopher YOUTSEY, David MCCALLUM, Genevieve MARTIN
  • Patent number: 7994419
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: August 9, 2011
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Patent number: 7583900
    Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: September 1, 2009
    Assignee: Emcore Corporation
    Inventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum
  • Publication number: 20090044860
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 19, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
  • Publication number: 20090038678
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 12, 2009
    Applicant: MicroLink Devices, Inc.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
  • Publication number: 20080187316
    Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.
    Type: Application
    Filed: March 14, 2008
    Publication date: August 7, 2008
    Inventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum
  • Publication number: 20080186854
    Abstract: A telecommunications network comprises a plurality of network terminations interconnected through the network, each network termination being connectable to network termination equipment configurable for the input or output of data communicated between the terminations over the network. The data collection and generation equipment is controlled by a central server to generate data required for the monitoring of this performance, such as latency in a connection between two of the terminations. This server has configuration means for controlling a data retrieval means and data processing means to generate the outputs required of it, and is associated with a data storage means comprising means to store data relating to the arrangement of the network and the network terminations. The configuration means identifies, from the network data store, the network terminations required to perform the data collection required and transmits instructions to them to generate this data.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Applicant: BRITISH TELECOMMUNICATIONS public limited company
    Inventors: Peter G. Farrimond, Dan Hubscher, Adinarayana Kadiyam, Ian Newman, David McCallum, Alistair Munro
  • Publication number: 20080188191
    Abstract: A telecommunications network comprises a plurality of network terminations interconnected through the network, each network termination being connectable to network termination equipment configurable for the input or output of data communicated between the terminations over the network. The data collection and generation equipment is controlled by a central server to generate data required for the monitoring of this performance, such as latency in a connection between two of the terminations. This server has configuration means for controlling a data retrieval means and data processing means to generate the outputs required of it, and is associated with a data storage means comprising means to store data relating to the arrangement of the network and the network terminations. The configuration means identifies, from the network data store, the network terminations required to perform the data collection required and transmits instructions to them to generate this data.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Inventors: Peter G. Farrimond, Dan Hubscher, Adinarayana Kadiyam, Ian Newman, David McCallum, Alistair Munro
  • Patent number: 7359641
    Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: April 15, 2008
    Assignee: Emcore Corporation
    Inventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum
  • Publication number: 20070275605
    Abstract: A connector is provided for connecting a cable to a printed wiring board. The connector includes a dielectric housing, a conductive signal contact mounted on the housing for mating with a signal conductor of the cable, and a spring connector connected to the housing. The spring connector connects the signal contact on the housing to a signal contact on the printed wiring board.
    Type: Application
    Filed: February 2, 2005
    Publication date: November 29, 2007
    Inventors: George Hubbard, Edmund Poh, James McGrath, David McCallum
  • Publication number: 20070053821
    Abstract: A method for the manufacture of ammonium nitrate and LDH containing nitrate as an interlayer anion, the method including the steps of: (1) providing a source of nitric acid (2) providing a source of ammonia; (3) reacting ammonia with nitric acid to produce ammonium nitrate; (4) preparing a nitrate containing a first metal by reacting a compound containing the first metal with nitric acid or ammonium nitrate; (5) either. (a) preparing a nitrate containing a second metal by: (i) contacting a compound containing the second metal with nitric acid; or (ii) contacting a compound containing the second metal with ammonium nitrate; or (b) providing a compound containing the second metal; and (6) mixing the nitrate containing the first metal from step (4) with the nitrate containing the second metal or the compound containing the second metal from step (5) and ammonium hydroxide to form the LDH containing nitrate as an interlayer anion and ammonium nitrate.
    Type: Application
    Filed: April 13, 2004
    Publication date: March 8, 2007
    Inventors: Gavin Gillman, David McCallum
  • Patent number: D699901
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: February 18, 2014
    Assignee: American Valley Pet
    Inventors: Scott David McCallum, Bophet Inthivong