Patents by Inventor David McCallum
David McCallum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11901476Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: GrantFiled: February 8, 2021Date of Patent: February 13, 2024Assignee: MICROLINK DEVICES, INC.Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
-
Publication number: 20210323689Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: ApplicationFiled: June 23, 2021Publication date: October 21, 2021Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Publication number: 20210328093Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: ApplicationFiled: February 8, 2021Publication date: October 21, 2021Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
-
Patent number: 10923617Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: GrantFiled: June 21, 2011Date of Patent: February 16, 2021Assignee: MICROLINK DEVICES, INC.Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
-
Publication number: 20190322376Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: ApplicationFiled: February 22, 2019Publication date: October 24, 2019Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Patent number: 10214295Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: GrantFiled: May 8, 2017Date of Patent: February 26, 2019Assignee: MICROLINK DEVICES, INC.Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Publication number: 20170305564Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: ApplicationFiled: May 8, 2017Publication date: October 26, 2017Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Patent number: 9650148Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.Type: GrantFiled: April 18, 2016Date of Patent: May 16, 2017Assignee: MICROLINK DEVICES, INC.Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Publication number: 20170015430Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.Type: ApplicationFiled: April 18, 2016Publication date: January 19, 2017Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Patent number: 9315267Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: GrantFiled: February 15, 2013Date of Patent: April 19, 2016Assignee: MICROLINK DEVICES, INC.Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Publication number: 20130285440Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.Type: ApplicationFiled: February 15, 2013Publication date: October 31, 2013Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
-
Publication number: 20110318866Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film compound solar cell before it is separated from the substrate. To separate the thin film compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film compound solar cell.Type: ApplicationFiled: June 21, 2011Publication date: December 29, 2011Applicant: MICROLINK DEVICES, INC.Inventors: Noren PAN, Glen HILLIER, Duy Phach VU, Rao TATAVARTI, Christopher YOUTSEY, David MCCALLUM, Genevieve MARTIN
-
Patent number: 7994419Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: GrantFiled: July 3, 2008Date of Patent: August 9, 2011Assignee: MicroLink Devices, Inc.Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
-
Patent number: 7583900Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.Type: GrantFiled: March 14, 2008Date of Patent: September 1, 2009Assignee: Emcore CorporationInventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum
-
Publication number: 20090044860Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: ApplicationFiled: July 3, 2008Publication date: February 19, 2009Applicant: MicroLink Devices, Inc.Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
-
Publication number: 20090038678Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.Type: ApplicationFiled: July 3, 2008Publication date: February 12, 2009Applicant: MicroLink Devices, Inc.Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum
-
Publication number: 20080187316Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.Type: ApplicationFiled: March 14, 2008Publication date: August 7, 2008Inventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum
-
Publication number: 20080186854Abstract: A telecommunications network comprises a plurality of network terminations interconnected through the network, each network termination being connectable to network termination equipment configurable for the input or output of data communicated between the terminations over the network. The data collection and generation equipment is controlled by a central server to generate data required for the monitoring of this performance, such as latency in a connection between two of the terminations. This server has configuration means for controlling a data retrieval means and data processing means to generate the outputs required of it, and is associated with a data storage means comprising means to store data relating to the arrangement of the network and the network terminations. The configuration means identifies, from the network data store, the network terminations required to perform the data collection required and transmits instructions to them to generate this data.Type: ApplicationFiled: February 6, 2007Publication date: August 7, 2008Applicant: BRITISH TELECOMMUNICATIONS public limited companyInventors: Peter G. Farrimond, Dan Hubscher, Adinarayana Kadiyam, Ian Newman, David McCallum, Alistair Munro
-
Publication number: 20080188191Abstract: A telecommunications network comprises a plurality of network terminations interconnected through the network, each network termination being connectable to network termination equipment configurable for the input or output of data communicated between the terminations over the network. The data collection and generation equipment is controlled by a central server to generate data required for the monitoring of this performance, such as latency in a connection between two of the terminations. This server has configuration means for controlling a data retrieval means and data processing means to generate the outputs required of it, and is associated with a data storage means comprising means to store data relating to the arrangement of the network and the network terminations. The configuration means identifies, from the network data store, the network terminations required to perform the data collection required and transmits instructions to them to generate this data.Type: ApplicationFiled: February 6, 2007Publication date: August 7, 2008Inventors: Peter G. Farrimond, Dan Hubscher, Adinarayana Kadiyam, Ian Newman, David McCallum, Alistair Munro
-
Patent number: 7359641Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.Type: GrantFiled: June 28, 2004Date of Patent: April 15, 2008Assignee: Emcore CorporationInventors: John Dallesasse, Joseph Scheibenreif, Bryan Noble, Thomas Whitehead, Paul Wachtel, Bogdan Andrei, Dean Richardson, Brett Lane, Anthony Moretti, David McCallum