Abstract: An inkjet printhead includes a bi-layered nozzle plate having a plurality of nozzle apertures. The bi-layered nozzle plate being includes a lower first nozzle plate formed from a first material and an upper second nozzle plate disposed on the first nozzle plate, the second nozzle plate being formed from a second material. The first and second materials are different from each other and are each independently selected from the group consisting of: silicon nitride, silicon oxide and silicon oxynitride.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.

Abstract: An inkjet printhead assembly includes: an ink supply manifold; printhead integrated circuits attached to the ink supply manifold, each printhead integrated circuit having a frontside including drive circuitry and a plurality of inkjet nozzle assemblies disposed on the drive circuitry; and a connector film for supplying power to the drive circuitry. An integrated circuit contact positioned in a backside recessed portion of each printhead integrated circuit is connected to the connector film. The integrated circuit contact is electrically connected to the drive circuitry via a connector rod extending through the printhead integrated circuit.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.

Abstract: A method of fabricating integrated circuits is provided in which sacrificial material is provided on a first surface of a substrate to define structural elements, integrated circuit material is provided on the sacrificial material to provide integrated circuit structures as defined by the structural elements, the sacrificial material is removed from the first surface of the substrate to provide partially fabricated integrated circuits defined by the integrated circuit structures, a carrier handle is attached to the partially fabricated integrated circuits, and the substrate is thinned from a second surface of the substrate opposite the first surface to provide the fabricated integrated circuits.

Abstract: A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.

Abstract: A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.

Abstract: A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry.

Abstract: An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits.

Abstract: An inkjet printhead includes a bi-layered nozzle plate having a plurality of nozzle apertures. The bi-layered nozzle plate being includes a lower first nozzle plate formed from a first material and an upper second nozzle plate disposed on the first nozzle plate, the second nozzle plate being formed from a second material. The first and second materials are different from each other and are each independently selected from the group consisting of: silicon nitride, silicon oxide and silicon oxynitride.

Abstract: A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.

Abstract: An inkjet printhead with first and second nozzle plates. The first nozzle plate is comprised of a first material spanning a plurality of nozzles. The first nozzle plate has a plurality of cavities filled with a filler such that an upper surface of the first nozzle plate and an upper surface of the filler together define a contiguous planar surface. The second nozzle plate is comprised of a second material disposed on the planar surface.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.

Abstract: An inkjet printhead assembly includes: an ink supply manifold; printhead integrated circuits attached to the ink supply manifold, each printhead integrated circuit having a frontside including drive circuitry and a plurality of inkjet nozzle assemblies disposed on the drive circuitry; and a connector film for supplying power to the drive circuitry. An integrated circuit contact positioned in a backside recessed portion of each printhead integrated circuit is connected to the connector film. The integrated circuit contact is electrically connected to the drive circuitry via a connector rod extending through the printhead integrated circuit.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.

Abstract: An inkjet printhead comprising a reinforced bi-layered nozzle plate structure spanning across a plurality of nozzles is provided. Typically, the nozzle plate structure comprises: a first nozzle plate spanning a plurality of nozzles, the first nozzle plate having a plurality of cavities defined therein; photoresist filling the cavities; and a second nozzle plate covering said the first nozzle plate and the photoresist.

Abstract: A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.

Abstract: A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.

Abstract: A printhead integrated circuit comprising a silicon substrate defining a frontside and a backside, inkjet nozzle assemblies positioned at the frontside, drive circuitry for supplying power to the inkjet nozzle assemblies and through-silicon connectors extending from the frontside towards the backside. The through-silicon connectors provides electrical connections between the drive circuitry and corresponding integrated circuit contacts. The integrated circuit contacts are positioned for connection to a backside-mounted connector film supplying power to the drive circuitry.

Abstract: An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits.