Abstract: An electrosurgical apparatus comprising an electrosurgical forceps instrument that combines la robust jaw opening mechanism with an a microwave energy delivery mechanism. The instrument includes a rigid bracket mounted at a distal end of a flexible shaft, wherein a pair of jaws are pivotably mounted on the rigid bracket. The instrument includes an energy delivery structure comprising a flexible dielectric substrate having a first electrode and an second electrode formed on one of the pair of jaws, wherein the first electrode and the second electrode are arranged to emit microwave energy. The electrosurgical apparatus may also comprise a handpiece that combines rotation control of an electrosurgical instrument with both power delivery and end effector actuation (e.g. jaw closure, blade retraction or the like).

Abstract: A transceiver printed circuit board (PCB) includes an integrated circuit (IC) with at least two different functionality, a photodiode and a laser. The IC has a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side. The photodiode and the laser are both located in a first space beside the first side. The functionality of a transimpedance amplifier, a laser driver, and a clock and data recovery is integrated into the IC.

Abstract: A transmitter optical sub-assembly includes a body and a receptacle assembled to a front side of the body, the receptacle including a nose body, a split sleeve enclosed by the nose body, a first body disposed behind the split sleeve, and a fiber stub either glued or shrink fit or pressed fit on to the first body, a rear end of the split sleeve being slip fitted on to the fiber stub; wherein the nose body is made from deep drawing or cold forging process and is attached on to a front surface of the body.

Abstract: An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.

Abstract: A transmitter optical sub-assembly includes a body and a receptacle assembled to a front side of the body, the receptacle including a nose body, a split sleeve enclosed by the nose body, a first body disposed behind the split sleeve, and a fiber stub either glued or shrink fit or pressed fit on to the first body, a rear end of the split sleeve being slip fitted on to the fiber stub; wherein the nose body is made from deep drawing or cold forging process and is attached on to a front surface of the body.

Abstract: A transceiver printed circuit board (PCB) includes an integrated circuit (IC) with at least two different functionality, a photodiode and a laser. The IC has a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side. The photodiode and the laser are both located in a first space beside the first side. The functionality of a transimpedance amplifier, a laser driver, and a clock and data recovery is integrated into the IC.

Abstract: A transceiver module includes a printed circuit board and a metal housing enclosing the printed circuit board and defining a front opening, the metal housing including a base portion and a cover portion, the base portion including two opposite side portions, the cover portion including two opposite fixing portions each engaged with a corresponding side portion; wherein each of the side portions defines a gap having an outside opening on an outside wall thereof, each of the fixing portions includes a top portion inwardly extending from a top end thereof, and the top portion is inserted in a corresponding gap.

Abstract: A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.

Abstract: An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.

Abstract: A pull tab with exchangeable identification marker for pluggable communications modules is provided. In general, the pull tab includes an identification region that receives an exchangeable identification marker. The exchangeable identification marker is attached to the pull tab via at least one of compression, fastening, clipping, spring force, and retention features built into the pull tab. This attachment can be permanent, semi-permanent, removable, and combinations thereof. Moreover, the exchangeable identification marker can be attached to, and even removed from, the pull tab while the pluggable communications module is connected to other communications equipment.

Abstract: An optical communications module includes a housing that accommodates at least one optical receptacle having a cylindrical connector portion. The module further includes at least one deformable constraining member made of a material having a Young's modulus that allows the deformable constraining member to take on an initial deformity upon application of a compression force, but permits only a partial reversal of the deformity upon reduction or removal of the compression force. The initial deformity is created when the deformable constraining member is pressed against the cylindrical connector portion during assembly of the module. The initial deformity includes a deformed contour portion that conforms to at least a part of the cylindrical connector portion of the optical receptacle and prevents wiggling of the cylindrical connector portion after the cylindrical connector portion is pushed during assembly into an alignment notch provided in a lower housing portion of the module.

Abstract: A fiber optic transceiver comprising a substrate, a heat dissipating structure, a receptacle and a light source is disclosed. The substrate may have a hole extending therethrough. The heat dissipating structure may be coupled to the substrate and may comprise a major surface, a plurality of fins, a projecting member, and a plurality of insulating protrusions. The plurality of fins may project from the major surface of the heat dissipating structure away from the substrate. The projecting member may extend partially or completely through the hole of the substrate. The plurality of insulating protrusions may extend substantially perpendicularly from the major surface of the heat dissipating structure and coupled to the substrate. The plurality of insulating protrusions may be configured to separate the major surface of the heat dissipating structure with the substrate so as to reduce heat transfer between the substrate and the heat dissipating structure.

Abstract: A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.

Abstract: A pull tab with exchangeable identification marker for pluggable communications modules is provided. In general, the pull tab includes an identification region that receives an exchangeable identification marker. The exchangeable identification marker is attached to the pull tab via at least one of compression, fastening, clipping, spring force, and retention features built into the pull tab. This attachment can be permanent, semi-permanent, removable, and combinations thereof. Moreover, the exchangeable identification marker can be attached to, and even removed from, the pull tab while the pluggable communications module is connected to other communications equipment.

Abstract: A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.

Abstract: A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer.

Abstract: An optical module and chassis incorporating “keying” features that ensure the correct insertion of the module into a given chassis, thereby preventing damage to the module and/or the system to which the chassis is connected.

Abstract: A pluggable optical module for use with optical communication systems, wherein the pluggable optical module comprises a housing having an opening arranged to receive a subassembly, wherein the subassembly is capable of being removably inserted into the housing.

Abstract: A module houses an optical transceiver device and provides a dedicated heat-transfer environment for the device. A fan draws in ambient air and blows it through a heat exchanger and out an exhaust. Heat transfer is by conduction from the device into the heat exchanger through an opening in an EMI shield of the device. In some embodiments the fan is a pluggable unit, allowing quick replacement if status LEDs indicate a fault.

Abstract: An optoelectronic device having a hermetically sealed optoelectronic component and to a method of forming the device, which may for example be an optical transmitter or receiver device for use in a fibre optic communications network. The optoelectronic device comprises a first sub-assembly and a second sub-assembly, the first sub-assembly comprising at least one optoelectronic component. The optoelectronic component is optically aligned with the at least one optical element along an optical axis to from form a housing for the optoelectronic component, the sub-assemblies being joined by at least two joins across the interface including at least one non-hermetic join and separate from the non-hermetic join(s) a hermetic join that extends fully around the optical axis to seal hermitically the optoelectronic component within the housing.