Patents by Inventor David Merrick
David Merrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10705541Abstract: Systems, apparatuses and methods for landing an unmanned aircraft on a mobile structure are presented. Sensors on the aircraft identify a predetermined landing area on a mobile structure. The aircraft monitors the sensor data to maintain its position hovering over the landing area. The aircraft estimates a future attitude of the surface of the landing area and determines a landing time that corresponds to a desired attitude of the surface of the landing area. The unmanned aircraft executes a landing maneuver to bring the aircraft into contact with the surface of the landing area at the determined landing time.Type: GrantFiled: March 25, 2016Date of Patent: July 7, 2020Assignee: PLANCK AEROSYSTEMS INC.Inventors: David Merrick Twining, Joshua Wells
-
Publication number: 20180173245Abstract: Systems, apparatuses and methods for landing an unmanned aircraft on a mobile structure are presented. Sensors on the aircraft identify a predetermined landing area on a mobile structure. The aircraft monitors the sensor data to maintain its position hovering over the landing area. The aircraft estimates a future attitude of the surface of the landing area and determines a landing time that corresponds to a desired attitude of the surface of the landing area. The unmanned aircraft executes a landing maneuver to bring the aircraft into contact with the surface of the landing area at the determined landing time.Type: ApplicationFiled: March 25, 2016Publication date: June 21, 2018Inventors: David Merrick TWINING, Joshua WELLS
-
Publication number: 20070290535Abstract: A vehicle safety seat may comprise, among other things, a vehicle seat having a seat base configured to be mounted to a support surface of a motor vehicle, and a roll sensor mounted to the seat base. The vehicle seat may be a suspension seat. The vehicle seat may have other sensors, event detection systems or the like mounted thereto. The vehicle seat may include a number of vehicle/occupant safety mechanisms integral therewith.Type: ApplicationFiled: October 19, 2005Publication date: December 20, 2007Applicant: INDIANA MILLS & MANUFACTURING, INC.Inventors: Jeffery Meredith, James Chinni, Marius Magdun, Chris Jessup, Douglas Bittner, David Merrick
-
Publication number: 20070120001Abstract: A load control device comprises a frame defining a first anchor slot configured to receive a first restraint member, and a second anchor slot configured to receive a second restraint member. At least a portion of the frame yields under a load between the first and second anchor slots that is in excess of a predetermined load.Type: ApplicationFiled: December 14, 2005Publication date: May 31, 2007Inventors: James Esler, Michael Wiseman, James Anthony, David Merrick, Guy Dingman
-
Publication number: 20060053903Abstract: A web tension indicator comprises a housing configured to receive a web therethrough, a spring member carried within the housing, and means for indicating that the web is under tension when a force resulting from tension applied to the web is applied by the web against the spring member. The spring member may be a linear or coiled spring.Type: ApplicationFiled: September 8, 2005Publication date: March 16, 2006Inventors: Steven Berenyi, Guy Dingman, David Merrick, Michael Ayette
-
Patent number: 6824665Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.Type: GrantFiled: October 17, 2001Date of Patent: November 30, 2004Assignee: Shipley Company, L.L.C.Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
-
Patent number: 6660154Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.Type: GrantFiled: October 17, 2001Date of Patent: December 9, 2003Assignee: Shipley Company, L.L.C.Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
-
Patent number: 6660153Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.Type: GrantFiled: October 17, 2001Date of Patent: December 9, 2003Assignee: Shipley Company, L.L.C.Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
-
Patent number: 6624070Abstract: Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.Type: GrantFiled: October 24, 2001Date of Patent: September 23, 2003Assignee: Shipley Company, L.L.C.Inventors: David Merricks, Martin T. Goosey, Narinder Bains
-
Patent number: 6531046Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.Type: GrantFiled: December 15, 2000Date of Patent: March 11, 2003Assignee: Shipley Company, L.L.C.Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, III, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
-
Publication number: 20020134684Abstract: Disclosed is a process flows for treating seed layers including copper such that various problems such as oxidation and insufficient coverage can be repaired in an effective and efficient manner.Type: ApplicationFiled: October 25, 2001Publication date: September 26, 2002Applicant: Shipley Company, L.L.C.Inventors: Jeffrey M. Calvert, Denis Morrissey, David Merricks
-
Publication number: 20020132042Abstract: Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.Type: ApplicationFiled: October 24, 2001Publication date: September 19, 2002Applicant: Shipley Company, L.L.C.Inventors: David Merricks, Martin T. Goosey, Narinder Bains
-
Publication number: 20020090484Abstract: Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.Type: ApplicationFiled: October 17, 2001Publication date: July 11, 2002Applicant: Shipley Company, L.L.C.Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald R. Storjohann
-
Publication number: 20020088713Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.Type: ApplicationFiled: October 17, 2001Publication date: July 11, 2002Applicant: Shipley Company, L.L.C.Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
-
Publication number: 20020084193Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.Type: ApplicationFiled: October 17, 2001Publication date: July 4, 2002Applicant: Shipley Company, L.L.C.Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
-
Publication number: 20020066671Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.Type: ApplicationFiled: October 17, 2001Publication date: June 6, 2002Applicant: Shipley Company, L.L.C.Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
-
Publication number: 20020000382Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.Type: ApplicationFiled: December 15, 2000Publication date: January 3, 2002Applicant: Shipley Company, L.L.C. of MarlboroughInventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
-
Patent number: 5380066Abstract: A retractor having means for controlling the withdrawal of a belt therefrom operated by a push button. A retractor frame has a spring biased rotatably mounted spool wrappingly receiving one end of a belt harness with the belt harness having an opposite end with buckle members fixed thereto to receive a buckle tongue. A locking bar is engageable with ratchet shaped end plates of the spool. The locking bar is pivotable into the ratchet shaped end plates to prevent further withdrawal of the belt harness. A manual push button control causes movement of the locking bar away from the ratchet shaped end plates to allow withdrawal of the belt harness until the push button is released and the locking bar pivots into its normal position in contact with the ratchet shaped end plates.Type: GrantFiled: February 5, 1993Date of Patent: January 10, 1995Assignee: Indiana Mills & Manufacturing, Inc.Inventors: Michael A. Wiseman, Allan R. Lortz, David Merrick
-
Patent number: 4942649Abstract: A seat belt buckle has a plastic outer body of a color and style suitable for the intended environment, with a formed steel inner frame having horizontally-spaced upturned sides having two parallel pairs of in-turned flanges serving as crush inhibitors, release slide guides, and tongue receiver guides. An upturned frame front flange cooperates with the sides and flanges as a wrack resistor and tongue retainer. The body front has a trough-shaped entrance to admit a latchable tongue, one margin of the entrance being provided by the sloped front of an end-release operating slide. A removable slide front button is curved to assist finding for release. A pivoting latching member with a latching pawl thereon is spring-urged into position latching the pawl with the tongue, and released by a cam on the slide, with a shallow ramp for ease of intentional release. A tongue ejector holds the pawl in unlatched position when the tongue is out of the buckle.Type: GrantFiled: May 30, 1989Date of Patent: July 24, 1990Assignee: Indiana Mills & Manufacturing, Inc.Inventors: James R. Anthony, David Merrick, Ronald F. Homeier, Allan R. Lortz
-
Patent number: D338119Type: GrantFiled: December 9, 1991Date of Patent: August 10, 1993Assignee: Indiana Mills & Manufacturing, Inc.Inventor: David Merrick