Patents by Inventor David Merricks

David Merricks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seed layer deposition
    Patent number: 6824665
    Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: November 30, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
  • Seed layer
    Patent number: 6660154
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Seed layer repair bath
    Patent number: 6660153
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: December 9, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Plating catalysts
    Patent number: 6624070
    Abstract: Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: September 23, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: David Merricks, Martin T. Goosey, Narinder Bains
  • Seed layer repair method
    Patent number: 6531046
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, III, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Seed layer processes
    Publication number: 20020134684
    Abstract: Disclosed is a process flows for treating seed layers including copper such that various problems such as oxidation and insufficient coverage can be repaired in an effective and efficient manner.
    Type: Application
    Filed: October 25, 2001
    Publication date: September 26, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Denis Morrissey, David Merricks
  • Plating catalysts
    Publication number: 20020132042
    Abstract: Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.
    Type: Application
    Filed: October 24, 2001
    Publication date: September 19, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Martin T. Goosey, Narinder Bains
  • Plating bath
    Publication number: 20020090484
    Abstract: Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald R. Storjohann
  • Seed layer repair bath
    Publication number: 20020088713
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 11, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Seed layer
    Publication number: 20020084193
    Abstract: Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
    Type: Application
    Filed: October 17, 2001
    Publication date: July 4, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: David Merricks, Denis Morrissey, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann
  • Seed layer deposition
    Publication number: 20020066671
    Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
    Type: Application
    Filed: October 17, 2001
    Publication date: June 6, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
  • Seed layer repair method
    Publication number: 20020000382
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Application
    Filed: December 15, 2000
    Publication date: January 3, 2002
    Applicant: Shipley Company, L.L.C. of Marlborough
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann