Patents by Inventor David Mi

David Mi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9778782
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue laver.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: October 3, 2017
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Publication number: 20170131822
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue laver.
    Type: Application
    Filed: July 15, 2015
    Publication date: May 11, 2017
    Inventor: David MI
  • Patent number: 9367180
    Abstract: A projected capacitive touch panel has a substrate, an X-axis electrode layer formed on a top of the substrate and a Y-axis electrode layer formed on a bottom of the substrate. The X-axis and the Y-axis electrode layers respectively have a plurality of X-axis electrodes and Y-axis electrodes arranged in a matrix form and respectively connected with a plurality of X-axis and Y-axis signal transmission lines. Each of the X-axis signal transmission lines and the Y-axis signal transmission lines is connected with a conversion module. The conversion modules is mounted to be adjacent to the X-axis and Y-axis signal transmission lines, converts analog signals into relatively stable digital signals, and transmits the digital signals to an external controller to determine coordinates being touch. Accordingly, lengths of the X-axis and Y-axis signal transmission lines can be shortened and the size of a control area of the touch panel can be enlarged.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: June 14, 2016
    Assignee: MASTOUCH OPTOELECTRONICS TECHNOLOGIES CO., LTD.
    Inventor: David Mi
  • Publication number: 20150317031
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue laver.
    Type: Application
    Filed: July 15, 2015
    Publication date: November 5, 2015
    Inventor: David MI
  • Patent number: 9116589
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue layer. Therefore, the touch panel of the present invention is thinner, provides better penetrability and costs less than conventional projected capacitive touch panels.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: August 25, 2015
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Patent number: 9019233
    Abstract: A projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink Layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer cover the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 28, 2015
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Patent number: 8947398
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: February 3, 2015
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Patent number: 8947399
    Abstract: A capacitive touch panel sequentially has a first transparent substrate, a lower touch sensitive layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second transparent substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed, thereby increase the yield in production and further facilitate producing large-size touch panel.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: February 3, 2015
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Patent number: 8937610
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: January 20, 2015
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Publication number: 20140152920
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue layer. Therefore, the touch panel of the present invention is thinner, provides better penetrability and costs less than conventional projected capacitive touch panels.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 5, 2014
    Applicant: TPK Touch Solutions Inc.
    Inventor: David MI
  • Patent number: 8686965
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue layer. Therefore, the touch panel of the present invention is thinner, provides better penetrability and costs less than conventional projected capacitive touch panels.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: April 1, 2014
    Assignee: TPK Touch Solutions Inc.
    Inventor: David Mi
  • Publication number: 20130277196
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive laver, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Application
    Filed: June 17, 2013
    Publication date: October 24, 2013
    Inventor: David MI
  • Publication number: 20130277197
    Abstract: A capacitive touch panel sequentially has a first transparent substrate, a lower touch sensitive layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive laver, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second transparent substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed, thereby increase the yield in production and further facilitate producing large-size touch panel.
    Type: Application
    Filed: June 17, 2013
    Publication date: October 24, 2013
    Inventor: David MI
  • Publication number: 20130271205
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Application
    Filed: June 17, 2013
    Publication date: October 17, 2013
    Inventor: David MI
  • Patent number: 8487904
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: July 16, 2013
    Assignee: Mastouch Optoelectronics Technologies Co., Ltd.
    Inventor: David Mi
  • Publication number: 20120038560
    Abstract: A projected capacitive touch panel has a substrate, an X-axis electrode layer formed on a top of the substrate and a Y-axis electrode layer formed on a bottom of the substrate. The X-axis and the Y-axis electrode layers respectively have a plurality of X-axis electrodes and Y-axis electrodes arranged in a matrix form and respectively connected with a plurality of X-axis and Y-axis signal transmission lines. Each of the X-axis signal transmission lines and the Y-axis signal transmission lines is connected with a conversion module. The conversion modules is mounted to be adjacent to the X-axis and Y-axis signal transmission lines, converts analog signals into relatively stable digital signals, and transmits the digital signals to an external controller to determine coordinates being touch. Accordingly, lengths of the X-axis and Y-axis signal transmission lines can be shortened and the size of a control area of the touch panel can be enlarged.
    Type: Application
    Filed: October 1, 2010
    Publication date: February 16, 2012
    Applicant: MASTOUCH OPTOELECTRONICS TECHNOLOGIES CO., LTD.
    Inventor: David Mi
  • Publication number: 20120007824
    Abstract: A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 12, 2012
    Inventor: David MI
  • Publication number: 20110234526
    Abstract: A single-layer projected capacitive touch panel has a glass cover, a touch sensing circuit layer, an insulating ink layer, a conductive wire layer, an insulator layer, a conductive glue layer and a flexible printed circuit (FPC) board. The touch sensing circuit layer, the insulating ink layer, the conductive wire layer, the insulator layer and the conductive glue layer are mounted on a circuit surface of the glass cover in sequence. The insulating ink layer covers the touch sensing circuit layer and has multiple through slots. Each through slot is filled with an electric conductor. The FPC is fastened on the conductive wire layer by a conductive glue layer. Therefore, the touch panel of the present invention is thinner, provides better penetrability and costs less than conventional projected capacitive touch panels.
    Type: Application
    Filed: March 24, 2010
    Publication date: September 29, 2011
    Inventor: David Mi
  • Patent number: 7737338
    Abstract: Basically, this invention provides for an inbred corn line designated NPAF4467, methods for producing a corn plant by crossing plants of the inbred line NPAF4467 with plants of another corn plants. The invention relates to the various parts of inbred NPAF4467 including culturable cells. This invention also relates to methods for introducing transgenic transgenes into inbred corn line NPAF4467 and plants produced by said methods.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: June 15, 2010
    Assignee: Syngenta Participations, AG
    Inventor: David Mies
  • Patent number: 6573438
    Abstract: The present invention is drawn to a novel DNA construct comprising an expression cassette having a constitutive promoter which functions in plant cells operably linked to a maize alcohol dehydrogenase intron, a DNA sequence of a gene encoding a Cry 1Ab protein, and a terminator functional in plants and optionally further comprising a second cassette including a promoter which functions in plants operably linked to a maize alcohol dehydrogenase intron, a DNA sequence of a gene encoding for phosphinothricin acetyl transferase, and a terminator functional in plants wherein the two cassettes are transcribed in the same direction. Also provided are transgenic plants, particularly maize plants, having such a construct stably incorporated into their genomes.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: June 3, 2003
    Assignee: Syngenta Participations AG
    Inventors: Irvin J. Mettler, David Mies