Patents by Inventor David Moore Parks

David Moore Parks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasticity induced bonding
    Patent number: 10703048
    Abstract: Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: July 7, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: Nikhil Padhye, David Moore Parks, Bernhardt Levy Trout, Alexander H. Slocum
  • PLASTICITY INDUCED BONDING
    Publication number: 20190134916
    Abstract: Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 9, 2019
    Applicant: Massachusetts Institute of Technology
    Inventors: Nikhil Padhye, David Moore Parks, Bernhardt Levy Trout, Alexander H. Slocum
  • Plasticity induced bonding
    Patent number: 10213960
    Abstract: Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: February 26, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Nikhil Padhye, David Moore Parks, Bernhardt Levy Trout, Alexander H. Slocum
  • PLASTICITY INDUCED BONDING
    Publication number: 20170080637
    Abstract: Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.
    Type: Application
    Filed: May 20, 2015
    Publication date: March 23, 2017
    Applicant: Massachusetts Institute to Technology
    Inventors: Nikhil Padhye, David Moore Parks, Bernhardt Levy Trout, Alexander H. Slocum