Abstract: A mobile drilling rig is configured to drill boreholes into the ground about a drill site. To assist navigating the mobile drilling rig and other machines about the drill site, a material pile mapping system can be included that includes the borehole locations and an estimated material pile dimension associated with a material pile formed about the borehole from material removed during drilling of the borehole. The material pile dimension can be estimated from an estimated material pile volume of the material removed from the borehole.

Abstract: A composite oxidation catalyst for use in an exhaust system for treating an exhaust gas produced by a vehicular compression ignition internal combustion engine is disclosed. The composite oxidation catalyst comprises a honeycomb flow-through substrate monolith and two catalyst washcoat zones arranged axially in series on and along the substrate surface.

Abstract: An applicator (1) comprising: a body (2) defining a chamber (14) for storing an adhesive composition, and an outlet (16) for delivering the adhesive composition stored in the chamber (14), a piston (4) mobile in translation relative to the body (2), a drive element (6) mobile in rotation relative to the body (2), and configured to be releasably engaged with a guide (100, 200, 300) external to the applicator (1), wherein rotating the drive element (6) relative to the body (2) causes the piston (4) to translate relative to the body (2) so as to reduce a volume of the chamber (14) and force the adhesive composition out of the applicator (1) through the outlet (16).

Abstract: An oil level measuring device has a distal end and a proximal end. The oil level measuring device includes an arm comprising a first channel and a second channel, an electronic oil level sensor comprising a measuring mean configured to measure the level of the oil in an oil pan and a connecting port, the measuring mean being hosted into the first channel of the arm, a dipstick hosted into the second channel of the arm and configured to dip into the oil in the oil pan.

Abstract: A method of fabricating a semiconductor structure includes forming a plurality of semiconductor fins disposed on a semiconductor substrate, wherein at least one of the fins is an unwanted fin including a semiconductor material; providing a conformal protective layer over the plurality of semiconductor fins; forming a mask having an opening over the unwanted fin; removing a portion of the unwanted fin to expose a fin spike; oxidizing the fin spike to form an oxidized semiconductor material; and removing the oxidized semiconductor material to expose a fin base.

Abstract: A method of fabricating a semiconductor structure includes forming a plurality of semiconductor fins disposed on a semiconductor substrate, wherein at least one of the fins is an unwanted fin including a semiconductor material; providing a conformal protective layer over the plurality of semiconductor fins; forming a mask having an opening over the unwanted fin; removing a portion of the unwanted fin to expose a fin spike; oxidizing the fin spike to form an oxidized semiconductor material; and removing the oxidized semiconductor material to expose a fin base.

Abstract: A cryogenic cooling manifold and methods incorporating a cryogenic cooling manifold for managing the gas layer(s) above a liquid cryogen to control cooling temperature-time profiles and ice formation for microliter and smaller samples that are plunged through the gas and into the liquid cryogen.

Abstract: A method includes forming a plurality of fin elements above a substrate. A mask is formed above the substrate. The mask has an opening defined above at least one selected fin element of the plurality of fin elements. An ion species is implanted into the at least one selected fin element through the opening to increase its etch characteristics relative to the other fin elements. The at least one selected fin element is removed selectively relative to the other fin elements.

Abstract: A dielectric layer overlies a semiconductor substrate. The substrate has components and appropriate contacts formed therein. The dielectric layer electrically insulates the substrate and components from overlying conductive interconnect layers. A barrier layer is arranged over the dielectric layer to isolate the interconnect layers from other structures. A copper layer is then deposited over the barrier layer and thick interconnect lines having a first width and a first height are realized. Then, the barrier layer is etched using one of many alternative techniques. The barrier layer has a second width and a second height wherein the second width of the barrier liner is selected to be greater than the first width of the thick copper interconnect.

Abstract: A method of automatically manufacturing a filled packette having a closure where a film is advanced from a feed roller to a punch that produces a series of holes in the film. Individual closures are then positioned into each punched hole and ultrasonically welded into place. The film is folded and oriented vertically so that heat sealing may be used to form the side and bottom edges of individual pockets. The film is then clipped to form individual pockets and filed with the appropriate amount of desired material from a bulk feeder. The filled pockets may be sealed along the top edge to form a closed packette and die cut to form the final packette shape.

Abstract: A method of automatically manufacturing a filled packette having a closure where a film is advanced from a feed roller to a punch that produces a series of holes in the film. Individual closures are then positioned into each punched hole and ultrasonically welded into place. The film is folded and oriented vertically so that heat sealing may be used to form the side and bottom edges of individual pockets. The film is then clipped to form individual pockets and filed with the appropriate amount of desired material from a bulk feeder. The filled pockets may be sealed along the top edge to form a closed packette and die cut to form the final packette shape.

Abstract: A dielectric layer overlies a semiconductor substrate. The substrate has components and appropriate contacts formed therein. The dielectric layer electrically insulates the substrate and components from overlying conductive interconnect layers. A barrier layer is arranged over the dielectric layer to isolate the interconnect layers from other structures. A copper layer is then deposited over the barrier layer and thick interconnect lines having a first width and a first height are realized. Then, the barrier layer is etched using one of many alternative techniques. The barrier layer has a second width and a second height wherein the second width of the barrier liner is selected to be greater than the first width of the thick copper interconnect.

Abstract: A system and method are disclosed for detecting and preventing bridge loops in a relatively low cost bridge module designed for installation in a network hub. The bridge operates to monitor an intra-hub communication path of the network hub to detect bridge protocol data units transmitted by a switching fabric within the network hub. The bridge module stores a MAC source address of a bridge protocol data unit detected on the intra-hub communications path, and forwards the bridge protocol data unit through its external communication ports to respective network segments. The bridge module monitors its external communication ports for any data unit having a destination address matching a bridge multicast address. When a data unit having a destination address matching the bridge multicast address is detected, the bridge module compares the MAC source address of that data unit to the previously stored MAC source address from the bridge protocol data unit detected on the intra-hub communication path.