Abstract: An acoustic detection and localization system includes a signal acquisition stage, a biomimetic processor, and an acoustic feature processor. The system uses multiple acoustic cues including spectral content, inter-aural time delay (ITD), inter-aural intensity difference (IID), and periodicity content to detect, classify, and localize sound sources. Pairs of acoustic sensors are arranged geometrically with a spacing depending on the application. The biomimetic processing provides for echo suppression to enhance performance in reverberant environments, and automatic gain controls for robustness in noisy environments. Applications include mobile robotic platforms for reconnaissance and surveillance, helmet mounted systems for sniper detection, vehicle-mounted systems for combat awareness, general civilian security systems, and systems for environmental monitoring and tracking of animals.

Abstract: The present invention is a method of fabricating a semiconductor device using a fully cured BCB layer and removing the same using wet etching. The first step is selecting a substrate. The second step of the method is producing an oxide layer or other coating on the substrate. The third step is applying a BCB layer on the oxide layer. The fourth step is fully curing the BCB layer. The fifth step is processing the device. The sixth step is stressing the substrate, preferably causing the substrate to warp. The seventh step is wet etching the BCB layer. The eighth step is removing the BCB layer. The ninth step is removing the oxide layer.