Abstract: An electronic enclosure assembly having a logic chassis, a forward extension member attached to one end of the logic chassis wherein each side of the forward extension member has side pieces, each of the side pieces having a face and a notch. The enclosure further includes a removable chassis having a front side and a rearward side and sized to fit between the side pieces and slidably movable on the extension until it is engaged with the logic chassis. An activation handle having side members is pivotally attached on the sides and at front end of the removable chassis and is movable between an up position and a down position. The ends of the side members and the notches of the side pieces of the logic chassis cooperate for camming the removable chassis into engagement with the logic chassis when the activation handle is moved to its up position and for camming the removable chassis away and disengaging the removable chassis from the logic chassis when said activation handle is returned to its down position.

Abstract: A modular node assembly for a rack mounted multiprocessor computer in which the node assembly has a logic chassis and a removable chassis. The logic chassis contains logic cards including memory cards, a service processor card, Central Processing Unit (CPU) processor cards, and Input/Output (I/O) cards to which I/O and processor interconnecting cables are attached. The removable chassis contains the power supply module for the node, a node supervisor card, disk drives and cooling fans. The removable chassis is removable from the logic chassis without moving or disturbing the logic chassis. One fan of a pair of cooling fans in the removable chassis draws air through the power supply, which has relatively higher cooling needs, and blows the air into the logic chassis over logic modules having relatively lower cooling needs.