Abstract: A method of forming a self-aligned gated field emitter with reduced gate opening and uniform gate height, on a substrate, is described. A field emitter is formed on the substrate. A thin, conformal dielectric layer is formed over the field emitter and the substrate. A thick dielectric layer is formed over the thin, conformal dielectric layer. The thick dielectric layer is planarized. The thick dielectric layer is etched back. A conductive layer is formed over the thick dielectric layer. The conductive layer is planarized and then etched back. The field emitter is exposed by forming an opening in the conductive layer, by removing the portion of the thin, conformal dielectric layer above and around the top of the field emitter.