Patents by Inventor David N. Light
David N. Light has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11895777Abstract: A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.Type: GrantFiled: September 24, 2021Date of Patent: February 6, 2024Assignee: IDEX BIOMETRICS ASAInventor: David N. Light
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Publication number: 20230101831Abstract: A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.Type: ApplicationFiled: September 24, 2021Publication date: March 30, 2023Applicant: IDEX BIOMETRICS ASAInventor: David N. Light
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Patent number: 10776600Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: GrantFiled: April 5, 2018Date of Patent: September 15, 2020Assignee: IDEX Biometrics ASAInventors: Fred G. Benkley, III, David N. Light, David Rodney Baker, Thomas Gaudette
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Patent number: 10713461Abstract: A sensor assembly includes a flexible substrate with conductive traces formed on opposed sides of the substrate and oriented transversely to each other. The substrate is wrapped around a core so that the traces formed on opposed sides of a first part of the substrate form a first sensor surface on one surface of the core, and the traces formed on opposed sides of a second part of the substrate form a second sensor surface on an opposed surface of the core. The core may comprise an encapsulant overmolded onto the conductive traces on a surface of the first part of the substrate, and the second part of the substrate is folded over the encapsulant. The sensor assembly may include an integrated circuit disposed on the flexible substrate, wherein one or more of the conductive traces are electrically connected to each integrated circuit.Type: GrantFiled: September 18, 2018Date of Patent: July 14, 2020Assignee: IDEX Biometrtics ASAInventors: Fred G. Benkley, III, David N. Light
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Patent number: 10687424Abstract: A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other “Internet of Things” (IOT) electronic device.Type: GrantFiled: January 24, 2018Date of Patent: June 16, 2020Assignee: IDEX Biometrics ASAInventors: Fred G. Benkley, III, David N. Light, David Joseph Geoffroy, Massimo Eugenio Ravelli
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Patent number: 10675791Abstract: A plurality of molded cover members are manufactured by first singulating a single sheet of cover material, such as glass, into a plurality of separate, discrete cover members, placing the cover members in spaced-apart positions on a releaseable carrier, and applying a molded material to the perimeter of each cover member. The molded material can be applied by a blanket molding technique whereby gaps between adjacent cover members are filled, and then the cover members are singulated, leaving a portion of the cover material on the perimeter of each cover member, and then the singulated, molded cover members are released from the releasable carrier. Alternatively, the molded material is applied by a patterned molding technique whereby molding material is applied to the perimeter of each cover member without fully filling the gaps between adjacent cover members, and then the molded cover members are released from the releasable carrier.Type: GrantFiled: September 1, 2017Date of Patent: June 9, 2020Assignee: IDEX Biometrics ASAInventors: David N. Light, Anne L. McAleer
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Patent number: 10387707Abstract: A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.Type: GrantFiled: June 20, 2017Date of Patent: August 20, 2019Assignee: IDEX ASAInventors: David Rodney Baker, David N. Light
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Patent number: 10331934Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: GrantFiled: November 17, 2016Date of Patent: June 25, 2019Assignee: IDEX ASAInventors: Fred G. Benkley, III, David N. Light, David Rodney Baker, Thomas Gaudette
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Publication number: 20190087622Abstract: A sensor assembly includes a flexible substrate with conductive traces formed on opposed sides of the substrate and oriented transversely to each other. The substrate is wrapped around a core so that the traces formed on opposed sides of a first part of the substrate form a first sensor surface on one surface of the core, and the traces formed on opposed sides of a second part of the substrate form a second sensor surface on an opposed surface of the core. The core may comprise an encapsulant overmolded onto the conductive traces on a surface of the first part of the substrate, and the second part of the substrate is folded over the encapsulant. The sensor assembly may include an integrated circuit disposed on the flexible substrate, wherein one or more of the conductive traces are electrically connected to each integrated circuit.Type: ApplicationFiled: September 18, 2018Publication date: March 21, 2019Applicant: IDEX ASAInventors: Fred G. Benkley, III, David N. Light
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Publication number: 20180232554Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: ApplicationFiled: April 5, 2018Publication date: August 16, 2018Applicant: IDEX ASAInventors: Fred G. Benkley, III, David N. Light, David Rodney Baker, Thomas Gaudette
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Publication number: 20180213646Abstract: A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other “Internet of Things” (IOT) electronic device.Type: ApplicationFiled: January 24, 2018Publication date: July 26, 2018Applicant: IDEX ASAInventors: Fred G. BENKLEY, III, David N. Light, David Joseph Geoffroy, Massimo Eugenio Ravelli
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Publication number: 20180065281Abstract: A plurality of molded cover members are manufactured by first singulating a single sheet of cover material, such as glass, into a plurality of separate, discrete cover members, placing the cover members in spaced-apart positions on a releaseable carrier, and applying a molded material to the perimeter of each cover member. The molded material can be applied by a blanket molding technique whereby gaps between adjacent cover members are filled, and then the cover members are singulated, leaving a portion of the cover material on the perimeter of each cover member, and then the singulated, molded cover members are released from the releasable carrier. Alternatively, the molded material is applied by a patterned molding technique whereby molding material is applied to the perimeter of each cover member without fully filling the gaps between adjacent cover members, and then the molded cover members are released from the releasable carrier.Type: ApplicationFiled: September 1, 2017Publication date: March 8, 2018Applicant: IDEX ASAInventors: DAVID N. LIGHT, ANNE L. MCALEER
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Publication number: 20180068159Abstract: A method of securing a fingerprint sensor into a host device panel comprises, in one embodiment, securing a cover panel to the fingerprint sensor assembly and then securing the covered fingerprint sensor into a hole formed in the host device panel. In another embodiment, the cover panel is secured within a hole formed in the host device panel, and then the host device panel is placed over the fingerprint sensor assembly with the cover member aligned with the sensor assembly.Type: ApplicationFiled: September 1, 2017Publication date: March 8, 2018Applicant: IDEX ASAInventors: FRED G. BENKLEY, III, DAVID JOSEPH GEOFFROY, DAVID N. LIGHT
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Publication number: 20170372112Abstract: A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.Type: ApplicationFiled: June 20, 2017Publication date: December 28, 2017Applicant: IDEX ASAInventors: DAVID RODNEY BAKER, DAVID N. LIGHT
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Publication number: 20170147852Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.Type: ApplicationFiled: November 17, 2016Publication date: May 25, 2017Applicant: IDEX ASAInventors: FRED G. BENKLEY, III, DAVID N. LIGHT, DAVID RODNEY BAKER, THOMAS GAUDETTE
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Patent number: 6734368Abstract: A method for conductively bonding a printed circuit board to a metal back plate is provided. The method includes the steps of providing a dielectric substrate that is metallized on its two faces; providing a metallic back plate; and bonding the metallic back plate to one of the metallized faces of the substrate using an electrically conductive adhesive that includes an adhesive polymer and at least one conductive metal having an electromagnetic force (EMF) that is equal to or less than one volt. The present invention also relates to a printed circuit board assembly which includes printed circuit board which includes a dielectric substrate having a first circuitized metallic layer disposed on one opposing face of the substrate and a second metallic layer disposed on the other opposing face of said substrate; a metal back plate; and an electrically conductive bonding layer disposed between the plate and the second metallic layer of the printed circuit board.Type: GrantFiled: July 9, 1997Date of Patent: May 11, 2004Assignee: International Business Machines CorporationInventors: Lisa J. Jimarez, David N. Light
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Patent number: 5620782Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.Type: GrantFiled: June 2, 1995Date of Patent: April 15, 1997Assignee: International Business Machines CorporationInventors: Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias, John S. Kresge, David N. Light, Ajit K. Trivedi
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Patent number: 5574630Abstract: A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material having electrical circuitry thereon which carries an integrated circuit chip. The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material, typically copper, one of the layers of electrically-conducting material forming a power connection and another layer of the electrically-conducting material forming a ground plane. There is also at least one additional layer of a structural material having a relatively high Young's Modulus and a CTE of less than about 10 PPM/.degree.C. Invar or copper clad Invar are preferred materials for this structure.Type: GrantFiled: May 11, 1995Date of Patent: November 12, 1996Assignee: International Business Machines CorporationInventors: John S. Kresge, David N. Light, Tien Y. Wu
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Patent number: 5509196Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.Type: GrantFiled: September 21, 1994Date of Patent: April 23, 1996Assignee: International Business Machines CorporationInventors: Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias, John S. Kresge, David N. Light, Ajit K. Trivedi
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Patent number: 5384690Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.Type: GrantFiled: July 27, 1993Date of Patent: January 24, 1995Assignee: International Business Machines CorporationInventors: Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias, John S. Kresge, David N. Light, Ajit K. Trivedi