Abstract: A method for forming a low-energy electron excited fluorescent screen. First, there is dissolved in a non-aqueous solvent a charging material. The charging material when dissolved forms a cation which is susceptible to forming an oxide, which oxide is a first essential component of a low-energy electron excited fluorescent phosphor composition. In addition to the charging material, there is suspended in the non-aqueous solvent a phosphor which naturally adopts a positive charge in the non-aqueous solvent. The phosphor is a second essential component of the low-energy electron excited fluorescent phosphor composition. There is then electrophoretically deposited from the non-aqueous solvent the cation and the phosphor to form a low-energy electron excited fluorescent phosphor precursor composition. The electrophoretic deposition occurs upon a fluorescent screen substrate which serves as a cathode.

Abstract: Methods are available for making, and resultant structures of, a field emission display with soft luminescence and a comfortable image for a viewer of the display. The field emission display is formed with a baseplate and an opposing face plate. Field emission microtips are formed in openings in a conductive and insulating layer on the baseplate. An anode is formed on either the faceplate, or on the conductive layer surrounding each opening. Phosphorescent material is formed over the anode. A blocking layer is formed between the phosphor and the faceplate, such that during operation of the display direct light emission from the phosphor is blocked, resulting in indirect phosphorescence and a more comfortable display image. An optional reflective layer may be added over the conductive layer to increase phosphorescence.

Abstract: A method for fabricating high aspect ratio spacers for a field emission display is described. An array of field emission microtips is formed over a substrate. A layer of lithographic material is formed over the array of field emission microtips. Openings are formed in the layer of lithographic material. The openings may be formed by a plasma etch with oxygen, or by x-ray lithography. A non-outgassing material is formed over the surface of the layer of lithographic material, including in the openings. The openings are filled with a spacer material, the spacer material being a conductive material, an insulator, or, preferably, a combination thereof. Lastly, the layer of lithographic material and the non-outgassing material are removed.