Abstract: Aspects of the disclosure are directed to processing a component. A first coating is removed from a substrate of the component, the substrate including a first hole. Subsequent to removing the first coating from the substrate, a second coating is applied to the substrate, where a portion of the second coating at least partially blocks the first hole. Subsequent to applying the second coating to the substrate, the portion of the second coating is removed to generate a second hole through the second coating. The removal of the portion of the second coating creates a bore in the second coating that provides a clearance from an edge of the first hole on a surface of the substrate that interfaces to the second coating.

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.

Abstract: A weld clad layer having a substantially equiaxed grain microstructure may be formed by forming a repair area in a substrate, depositing a first layer of laser deposition spots in the repair area, and depositing a second layer of laser deposition spots over the first layer of laser deposition spots. The first layer of laser deposition spots may comprise a first laser deposition spot and a second laser deposition spot adjacent to the first laser deposition spot. The first laser deposition spot may solidify prior to deposition of the second laser deposition spot. The first layer of laser deposition spots may comprise titanium or titanium alloy.

Abstract: Aspects of the disclosure are directed to processing a component. A first coating is removed from a substrate of the component, the substrate including a first hole. Subsequent to removing the first coating from the substrate, a second coating is applied to the substrate, where a portion of the second coating at least partially blocks the first hole. Subsequent to applying the second coating to the substrate, the portion of the second coating is removed to generate a second hole through the second coating. The removal of the portion of the second coating creates a bore in the second coating that provides a clearance from an edge of the first hole on a surface of the substrate that interfaces to the second coating.

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.