Abstract: A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal such as gold is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141) at locations matching the first set pads. The second chip is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads, and at least one edge of the second chip overhangs the sphere on at least one pad of the second set.

Abstract: A method of applying a multi-component coating of a desired composition over a substrate includes providing a coating device in flow communication with a first coating component having a first rheological profile and at least one second coating component having a second rheological profile. The method further includes defining a desired ratio of the first and at least one second coating components to provide a coating of a desired composition, and selecting the rheological profiles of the first and at least one second coating components such that the coating components are supplied at a desired ratio.

Abstract: There is disclosed a process of priming a surface (preferably part of a vehicle) comprising; i) applying a UV radiation curable primer to the area to be primed; ii) curing the primer with UV radiation provided by one or more UV lamps having a UV-B:UV-A ratio of 1:1 or less and substantially no UV-C content, the UV radiation curable primer containing: A. 0-84% by weight of one or more compounds containing one ethylenically unsaturated free-radically polymerisable group per molecule; B. 5-50% by weight of one or more compounds containing two or more ethylenically unsaturated free radically polymerisable groups per molecule; C. 10-70% by weight of one or more pigments, fillers and/or dyes; D. 1-8% by weight of one or more photoinitiators; E. 0-20% by weight of volatile organic solvent and; F. 0-15% by weight of customary additives. Preferably the process also includes sanding the primer and topcoating the primer with one or more topcoats.

Abstract: A method of applying a multi-component coating of a desired composition over a substrate includes providing a coating device in flow communication with a first coating component having a first rheological profile and at least one second coating component having a second rheological profile. The method further includes defining a desired ratio of the first and at least one second coating components to provide a coating of a desired composition, and selecting the rheological profiles of the first and at least one second coating components such that the coating components are supplied at a desired ratio.

Abstract: A coating composition comprising a phenolic resin, an alkoxy silane, and an acid. The coating composition of the present invention promotes adhesion between a multiple layer coating composition and a substrate and between the respective layers of the multiple layer coating composition.

Abstract: The present invention comprises a low cost device (10, 20) and a method (30) of forming an electrical interconnect between two metal substrate layers configured in a flip-chip format or a wire bonded format. The invention includes a first metal substrate layer (12), a second metal substrate layer (14), and an organic tape layer (16) attached therebetween as a dielectric. The organic tape layer (16) includes a series of spaced apart vias (15) adapted to receive solder paste (13). The second metal layer (14) includes a plurality of openings (40,42,44) spaced along the surface thereof and coaxially aligned with the spaced vias (15). Further, the invention includes a plurality of solder balls (17, 18, 19) placed across the respective openings (40,42,44) of the second metal layer (14) such that each solder ball (17-19) attaches to the solder paste (13) forming an electrical interconnect running substantially in parallel between the metal layers (12, 14).

Abstract: A coating composition comprising at least one hydroxyl functional polymer, a crosslinker capable of crosslinking with said hydroxyl functional polymer (a) to form a film, and a reactive diluent comprising 1,3-cyclohexane dimethanol and 1,4-cyclohexane dimethanol.

Abstract: A coating composition comprising a phenolic resin, an alkoxy silane, and an acid. The coating composition of the present invention promotes adhesion between a multiple layer coating composition and a substrate and between the respective layers of the multiple layer coating composition.

Abstract: A coating composition comprising at least one hydroxyl functional polymer, a crosslinker capable of crosslinking with said hydroxyl functional polymer (a) to form a film, and a reactive diluent comprising 1,3-cyclohexane dimethanol and 1,4-cyclohexane dimethanol.

Abstract: A method for refinishing an area of an automobile's exterior is disclosed. The method comprises the following the steps: sanding the area of the automobile's exterior which is to be refinished; cleaning the sanded area; applying a layer of primer formed from a liquid primer or a pre-formed sheet of primer to the cleaned area; applying a layer of basecoat formed from a liquid basecoat or a pre-formed sheet of basecoat over the layer of primer; applying a layer of clearcoat formed from a liquid clearcoat or a pre-formed sheet of clearcoat over the layer of basecoat; and sanding and buffing the layer of clearcoat.

Abstract: The present invention comprises a low cost device (10, 20) and a method (30) of forming an electrical interconnect between two metal substrate layers configured in a flip-chip format or a wire bonded format. The invention includes a first metal substrate layer (12), a second metal substrate layer (14), and an organic tape layer (16) attached therebetween as a dielectric. The organic tape layer (16) includes a series of spaced apart vias (15) adapted to receive solder paste (13). The second metal layer (14) includes a plurality of openings (40,42,44) spaced along the surface thereof and coaxially aligned with the spaced vias (15). Further, the invention includes a plurality of solder balls (17, 18, 19) placed across the respective openings (40,42,44) of the second metal layer (14) such that each solder ball (17-19) attaches to the solder paste (13) forming an electrical interconnect running substantially in parallel between the metal layers (12, 14).

Abstract: A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity substrate. Cavities in the substrate accommodate semiconductor devices attached directly to the substrate. The semiconductor devices include at least one optical receiver and/or transmitter. A thin film overlay having multiple layers interconnects the semiconductor devices to an array of pads on a surface of the thin film overlay facing away from the substrate. Connectors are attached to the pads to provide direct electrical and mechanical attachment to other system hardware. In one embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay. In another embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through holes formed through the thin film overlay. The holes may be back filled with an optical quality material.

Abstract: The present invention comprises a low cost device (10, 20) and a method (30) of forming an electrical interconnect between two metal substrate layers configured in a flip-chip format or a wire bonded format. The invention includes a first metal substrate layer (12), a second metal substrate layer (14), and an organic tape layer (16) attached therebetween as a dielectric. The organic tape layer (16) includes a series of spaced apart vias (15) adapted to receive solder paste (13). The second metal layer (14) includes a plurality of openings (40,42,44) spaced along the surface thereof and coaxially aligned with the spaced vias (15). Further, the invention includes a plurality of solder balls (17, 18, 19) placed across the respective openings (40,42,44) of the second metal layer (14) such that each solder ball (17-19) attaches to the solder paste (13) forming an electrical interconnect running substantially in parallel between the metal layers (12, 14).

Abstract: A method of applying a multi-component coating of a desired composition over a substrate includes providing a coating device in flow communication with a first coating component having a first rheological profile and at least one second coating component having a second rheological profile. The method further includes defining a desired ratio of the first and at least one second coating components to provide a coating of a desired composition, and selecting the rheological profiles of the first and at least one second coating components such that the coating components are supplied at a desired ratio.

Abstract: A coating composition comprising a phenolic resin, an alkoxy silane, and an acid. The coating composition of the present invention promotes adhesion between a multiple layer coating composition and a substrate and between the respective layers of the multiple layer coating composition.

Abstract: There is disclosed a process of priming a surface (preferably part of a vehicle) comprising; i) applying a V radiation curable primer to the area to be primed; ii) curing the primer with UV radiation provided by one or more UV lamps having a UV-B:UV-A ratio of 1:1 or less and substantially no UV-C content, the UV radiation curable primer containing: A. 0-84% by weight of one or more compounds containing one ethylenically unsaturated free-radically polymerisable group per molecule; B. 5-50% by weight of one or more compounds containing two or more ethylenically unsaturated free radically polymerisable groups per molecule; C. 10-70 % by weight of one or more pigments, fillers and/or dyes; D. 1-8 % by weight of one or more photoinitiators; E. 0-20% by weight of volatile organic solvent and; F. 0-15% by weight of customary additives. Preferably the process also includes sanding the primer and topcoating the primer with one or more topcoats.

Abstract: A high density interconnect land grid array package device combines various electronic packaging techniques in a unique way to create a very thin, electrically and thermally high performance package for single or multiple semiconductor devices. A thin and mechanically stable substrate or packaging material (12) is selected that also has high thermal conductivity. Cavities (14) in the substrate or packaging material (12) accommodate one or more semiconductor devices that are attached directly to the substrate or packaging material. At least one of said semiconductor devices includes at least one optical receiver and/or transmitter. A thin film overlay (18) having multiple layers interconnects the one or more semiconductor devices to an array of pads (20) on a surface of the thin film overlay facing away from the substrate or packaging material.

Abstract: A high density interconnect land grid array package device combines various electronic packaging techniques in a unique way to create a very thin, electrically and thermally high performance package for single or multiple semiconductor devices. A thin and mechanically stable substrate or packaging material (12) is selected that also has high thermal conductivity. Cavities (14) in the substrate or packaging material (12) accommodate one or more semiconductor devices that are attached directly to the substrate or packaging material. At least one of said semiconductor devices includes at least one optical receiver and/or transmitter. A thin film overlay (18) having multiple layers interconnects the one or more semiconductor devices to an array of pads (20) on a surface of the thin film overlay facing away from the substrate or packaging material.

Abstract: Curable compositions containing novel polysiloxanes having various reactive functional groups are disclosed. The curable compositions are useful as both ambient-cured and thermally-cured coating compositions which provide such properties as excellent appearance, mar resistance, acid etch resistance, adhesion, pot life, improved tack time, mar resistance and corrosion resistance.

Abstract: Curable compositions containing novel polysiloxanes having various reactive functional groups are disclosed. The curable compositions are useful as both ambient-cured and thermally-cured coating compositions which provide such properties as excellent appearance, mar resistance, acid etch resistance, adhesion, pot life, improved tack time, mar resistance and corrosion resistance.