Abstract: In one embodiment, a method includes forming a base region for a transistor using a base mask and forming a contact region to the base region. The contact region is formed in an area that is at least partially outside of the base mask. The method then forms an emitter region in a diffused base region. The base region diffuses outwardly to be formed under the contact region.

Abstract: In one embodiment, a method includes forming a base region for a transistor using a base mask and forming a contact region to the base region. The contact region is formed in an area that is at least partially outside of the base mask. The method then forms an emitter region in a diffused base region. The base region diffuses outwardly to be formed under the contact region.

Abstract: In one embodiment, a method includes forming a first pad for coupling to a first terminal of a first transistor of a monolithic darlington transistor configuration and forming a second pad for coupling to a first terminal of a second transistor of the monolithic darlington transistor configuration. The method then forms a third pad for coupling to an external component for the monolithic darlington transistor configuration. The third pad is coupled to a second terminal of the first transistor and a second terminal of the second transistor of the monolithic darlington transistor configuration.

Abstract: In one embodiment, an apparatus includes a first transistor where the base of the first transistor is coupled to an input node. A second transistor is provided where the emitter of the first transistor is coupled to the base of the second transistor and the emitter of the second transistor is coupled to an output node. A third transistor is provided where the base of the third transistor is coupled to the input node. A fourth transistor is provided where the emitter of the third transistor is coupled to the base of the fourth transistor and the emitter of the fourth transistor is coupled to the output node and the base of the second transistor is coupled to the base of the fourth transistor. The base of the second transistor is coupled to the base of the fourth transistor through a shorting link.

Abstract: A method for reducing damage to a semiconductor structure resulting from migration of constituents of a first component part (3) of the structure into a subsequently deposited second component part (8) of the structure which makes contact with a surface of the first component part (3). A third component part (10) of the structure is deposited before the second component part (8), the third component part (10) being positioned so as to be contacted by the second component part (8) adjacent the said surface of the first component part (3). The third component part (10) has a composition such that it acts as a donor of constituents (12) to the second component part. The donor constituents (12) migrate into the second component part (8) when the second component part (8) is deposited and reduce the migration of constituents (11) of the first component part (3) into the second component part (8). If the first component part (3) is silicon, the third component part (10) may be polysilicon.

Abstract: A guard ring structure formed around the periphery of a bipolar semiconductor device. A guard region (11) is formed in a substrate (1) of the device so as to extend adjacent a peripheral portion of the device. An insulating layer (3) is formed on the substrate between the peripheral portion of the device and the guard region (11). A polysilicon layer (13) is formed on the insulating layer (3) and covered with a layer of densified dielectic (14). Electrical interconnections are provided between the polysilicon layer (13) and the guard region (11) at spaced apart portions of the device where the guard structure does not need to be protected by the densified dielectric.