Patents by Inventor David Nemeth

David Nemeth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230239049
    Abstract: Systems for establishing an ad-hoc optical communications link, the system comprising a first optical communications device at a first location and configured to generate a first optical signal; an optical receiver at a second location configured to receive the first optical signal; and a processor configured to generate, in response to the optical receiver receiving the first optical signal, instructions for directing a second optical communications device towards the first optical communications device, for establishing an optical communications link via a second optical signal generated by the first optical communications device. Systems for receiving an ad-hoc transmission of a message comprising a non-gimballed optical receiver having a frame rate greater than or equal to a modulation rate of the first optical signal, an optical aperture less than or equal to about 3 centimeters, and a field of view greater than or equal to about 5 degrees half angle.
    Type: Application
    Filed: December 22, 2022
    Publication date: July 27, 2023
    Inventor: David Nemeth
  • Publication number: 20060232364
    Abstract: A resonator filter assembly is provided having a first wafer (102), a second wafer (104) and a third wafer (106). A plurality of pits are etched in the first and second wafer (102, 104) and arranged such that a plurality of resonant cavities (108) are formed with a coupling cavity (110) disposed between the resonant cavities (108). By altering the dimensions of the resonant and coupling cavities (108, 110), the frequency characteristics of the filter can be adjusted as desired.
    Type: Application
    Filed: November 7, 2003
    Publication date: October 19, 2006
    Inventors: Philip Koh, David Nemeth
  • Publication number: 20050201711
    Abstract: A packaging system for optical or optoelectronic devices having a first package of micromachined material having at least one male connection component and a second package of micromachined material having at least one female component, wherein the male connection component is configured to mate with the female connection component. A mating surface of the male component and the female component has V-grooves designed to accept a first optical fiber and a second optical fiber, wherein the first V-groove (3) is configured to align with the second V-groove (6) when the first package and second package mate, thereby passively aligning the first optical fiber (4) with the second optical fiber (8) to form a high quality fiber butt joint. Alternatively, the female component is configured to accept a photodetector, wherein the first V-groove and second V-groove passively align the first optical fiber with the photodetector.
    Type: Application
    Filed: January 22, 2002
    Publication date: September 15, 2005
    Inventors: Philip Koh, Steven Marazita, David Nemeth