Patents by Inventor David Neuman
David Neuman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9781839Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.Type: GrantFiled: October 14, 2015Date of Patent: October 3, 2017Assignee: Automated Assembly CorporationInventors: David Neuman, Robert Neuman, Pat Connolly, Brian Backes
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Patent number: 9652705Abstract: RFID tag structures are disclosed. In one embodiment, the RFID tag includes a flexible substrate, a strap attached to the substrate, an RFID IC mounted on the strap, and an antenna. The strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The second surface of the strap is attached to the substrate. The RFID IC is electrically coupled to the first and second terminals. The antenna is attached to the first surface of the flexible substrate and connected to the first and second terminals on the first surface of the strap.Type: GrantFiled: February 21, 2012Date of Patent: May 16, 2017Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman
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Patent number: 9606285Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of light-emitting diodes (LEDs) have light emitting portions that face a portion of the light-diffusive plate. The LEDs are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.Type: GrantFiled: December 18, 2014Date of Patent: March 28, 2017Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman, Matthew Odden
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Patent number: 9431363Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.Type: GrantFiled: November 25, 2014Date of Patent: August 30, 2016Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman, Robert Neuman
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Patent number: 9379289Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.Type: GrantFiled: October 30, 2013Date of Patent: June 28, 2016Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman, Robert Neuman
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Patent number: 9151454Abstract: A lighting module is disclosed and includes a light emitting diode (LED) panel having a plurality of LEDs and two or more conductive contacts. A boxlike member has a base and sidewalls. The sidewalls have passages that provide ingress to and egress from the boxlike member for power wires. One or more mounting members are attached to the boxlike member for removably attaching the LED panel. A circuit board is disposed in the boxlike member, and the circuit board includes two or more insertion force connectors for connecting to power wires. The circuit board further includes two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts of the LED panel to the insertion force connectors.Type: GrantFiled: September 9, 2013Date of Patent: October 6, 2015Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman, Robert Neuman
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Patent number: 8940218Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.Type: GrantFiled: August 20, 2012Date of Patent: January 27, 2015Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman
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Patent number: 8893976Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.Type: GrantFiled: July 18, 2013Date of Patent: November 25, 2014Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman, Robert Neuman
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Patent number: 8890692Abstract: Approaches for aiding in recovery of lost articles are disclosed. A computing arrangement is configured with a database that contains article identifiers of a plurality of articles and associated data that identify owners of the articles. A handheld computing device reads an article identifier from an identification tag attached to an article and transmits the article identifier to the computing arrangement. The computing arrangement reads the data associated with the identifier that identifies the owner of the article in response to the identifier received from the handheld computing device and outputs the data that identifies the owner of the device.Type: GrantFiled: November 4, 2011Date of Patent: November 18, 2014Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman
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Patent number: 8779694Abstract: An LED lighting arrangement on a flexible substrate. The flexible substrate has an adhesive on a first surface. Straps are attached to the first surface of the flexible substrate by the adhesive. Each strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The attachment of each strap to the substrate is with the second surface of the strap adhered to the substrate. LEDs are attached to the straps and coupled to the terminals on the straps. An arrangement of one or more wires is attached to the first surface of the flexible substrate by the adhesive. The wires are connected to the first and second terminals on the first surfaces of the plurality of straps to provide power to the LEDs.Type: GrantFiled: December 8, 2011Date of Patent: July 15, 2014Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman
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Publication number: 20050173934Abstract: The invention concerns a device for maintaining on the ground the threshold bar, the bar which is used to assemble at a door two facings on the floor and which tends to be lifted at said ends. The device comprises a female part (1) provided with toothed notches (2) and a male part (3) provided with toothed notches (4) having a shape matching that of the toothed notches of the female part so as to fix the device on the door jamb (5). The male part and the female part are provided with an antiskid portion (6). The plate (7) of the male part is such that fixing the device on the door jamb prevents the threshold bar (8) from being lifted. The inventive device is designed to maintain on the ground threshold bars present in most dwellings.Type: ApplicationFiled: December 10, 2004Publication date: August 11, 2005Inventors: David Neuman, Michel Neuman, Julien Cristiani
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Publication number: 20050123125Abstract: The present invention provides an automated telephone dialing assistance module configured to be coupled with an existing telephone and to be incorporated with a telephone land line. A series of audio tags are programmable therein with an associated telephone number. The audio tags may be scrolled through using the module, and played over the speaker of the telephone. When a preselected audio tag is played, a dial button actuates the dialing of the associated telephone number. The module also allows audio tags and associated telephone numbers to be added and/or deleted.Type: ApplicationFiled: November 4, 2004Publication date: June 9, 2005Inventors: Jahn Stopperan, David Neuman
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Patent number: 6855921Abstract: A portable speed measurement apparatus for determining and displaying speed characteristics of a body passing through a target zone includes radiant energy beam generation units disposed in a first housing, the emitted beams of radiant energy defining a target zone therebetween, and radiant energy sensing units disposed in a second housing, the radiant energy sensing units operably generating an output electrical signal upon perception of pre-determined radiant energy characteristics. The first and second housings are configured and are sufficiently portable so that detection and speed measurement of a body moving through the target zone may be accomplished in any desired plane.Type: GrantFiled: December 13, 2002Date of Patent: February 15, 2005Inventors: Jahn Stopperan, Robert Neuman, David Neuman
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Patent number: 6384339Abstract: A new process for electrically and mechanically joining arrays of conductors on flexible printed circuits and other flexible conductors including collated flat, flexible cables (FFCs). An array of flat copper conductors on a flexible dielectric sheet is electroplated with tin-lead solder. Surface insulation is locally omitted or removed from conductor surfaces. A second circuit or cable is overlapped in competent electrical communication and the solder plating fused by inductively heating the copper to join the two conductor arrays. An adhesive placed between conductors is also thermally activated to bond the film on the two cable arrays together. This insulates the electrical connections and seals them from attack by moisture and chemical pollutants.Type: GrantFiled: March 12, 2001Date of Patent: May 7, 2002Assignee: Sheldahl, Inc.Inventor: David Neuman
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Patent number: 6226862Abstract: Disclosed is a new process for electrically and mechanically joining arrays of conductors on flexible printed circuits and other flexible conductors including collated flat, flexible cables (FFCs). An array of flat copper conductors on a flexible dielectric sheet is electroplated with tin-lead solder. Surface insulation is locally omitted or removed from conductor surfaces. A second circuit or cable is overlapped in competent electrical communication and the solder plating fused by inductively heating the copper to join the two conductor arrays. An adhesive placed between conductors is also thermally activated to bond the film on the two cable arrays together. This insulates the electrical connections and seals them from attack by moisture and chemical pollutants.Type: GrantFiled: April 30, 1998Date of Patent: May 8, 2001Assignee: Sheldahl, Inc.Inventor: David Neuman