Abstract: In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.

Abstract: Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signal between the layers. The via assembly also includes a capacitive structure connected to the signal via to adjust an impedance of the via assembly along the via assembly. The capacitive structure is physically and electrically separate from other components of the PCB.

Abstract: In some embodiments, an integrated circuit (IC) includes multiple packages that are separate from one another. Each package includes a pad, and a core via is electrically coupled to the pads of the separate packages to electrically couple the packages to one another. At least one of the pads includes an oblong shape to match its impedance with the impedance of the core via.

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Abstract: In some aspects, the techniques described herein relate to an apparatus for connecting cables to Input Output (IO) connector pins, including: a first Printed Circuit Board (PCB) configured to receive terminal ends of a plurality of cables, wherein the terminal ends of the plurality of cables are electrically isolated from one another in the first PCB; a second PCB configured to receive a plurality of IO connector pins, wherein the plurality of IO connector pins are electrically isolated from one another in the second PCB; and wherein the first PCB is configured to join to the second PCB to connect each of the terminal ends of the plurality of cables to corresponding pins of the plurality of IO connector pins.

Abstract: In some aspects, the techniques described herein relate to an apparatus including: a semiconductor device substrate material; a first signal conductor incorporated into the semiconductor device substrate material; a second signal conductor incorporated into the semiconductor device substrate material; and a ground conductor incorporated into the semiconductor device substrate material between the first signal conductor and the second signal conductor, wherein the ground conductor includes a first elongated portion and a second elongated portion arranged at an angle relative to the first elongated portion.

Abstract: Presented herein is a method comprising: determining skew values of cables, each skew value indicating a time of signal propagation along a respective cable at a respective signal frequency value, and the skew values being frequency dependent and varying at signal frequency values; determining skew behavior property values for each cable based on the skew values; determining a performance metric value for each skew behavior property value; determining a relationship between the skew values and the signal frequency values at each performance metric value based on the performance metric value for each skew behavior property value; and coupling a first electronic component and a second electronic component to one another using a new cable based on the relationship between the skew values and the signal frequency values at each performance metric value.

Abstract: A printed circuit board includes a grid of pads and tracks. The grid of pads includes a first pair of adjacent signal pads arranged in a first column and a second pair of adjacent signal pads arranged in a first row. A first signal pad of the second pair is arranged in the first column. The grid of pads also includes a third pair of adjacent signal pads arranged in a second row. A second signal pad of the first pair is arranged in the second row. The grid of pads further includes a fourth pair of adjacent signal pads arranged in a second column. A third signal pad of the third pair is arranged in the second column. A fourth signal pad of the fourth pair is arranged in the first row. The tracks are electrically coupled to the first, second, third, and fourth pairs.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.

Abstract: A communication interconnect system is described. The system may include a co-packaged cables (CPC) tile with a slot formed from a first surface to slot surface at a first depth in the CPC tile and a plurality of channels formed between the slot surface and a second surface opposite the first surface. The system may also include a twinaxial cable with a pair of conductors positioned in the slot such that the pair of conductors are inserted in a pair of channels of the plurality of channels to establish an electrical connection between the twinaxial cable and the pair of channels. The system also includes a plurality of elastomer pins positioned in the plurality of channels adjacent to the second surface.

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.