Patents by Inventor David Nuttall

David Nuttall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250010537
    Abstract: A hybrid additive manufacturing and thermoforming method is provided. The method includes additively manufacturing one or more reinforcing structures directly onto a polymer sheet before shaping the polymer sheet onto a mold and/or while the polymer sheet is shaped onto a mold. By leveraging the design control of additive manufacturing, reinforcing structures can be deposited onto the polymer sheet as needed based on the intended application. These reinforcing structures can comprise standard infill patterns or complex custom core designs. The present invention provides an innovative way in which to mass produce custom thermoformed components with an optimal mechanical response.
    Type: Application
    Filed: July 3, 2024
    Publication date: January 9, 2025
    Inventors: Ahmed A. Hassen, Christopher J. Hershey, Vipin Kumar, Vlastimil Kunc, David Nuttall, Ryan C. Ogle, Tyler C. Smith
  • Publication number: 20240124676
    Abstract: A improved method of additive manufacturing of a recycled granulate is provided. The method comprises providing a starting article. A shredder shreds the starting article to give a shredded product. A granulator shreds the shredded product to give a recycled granulate. The recycled granulate is fed into an additive manufacturing machine. The additive manufacturing machine prints a printed article using the recycled granulate. The method does not comprise a step of compounding the recycled granulate using a twin screw extruder. The starting article, the shredded product, and the recycle granulate each comprise a fiber reinforced polymer composite.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 18, 2024
    Inventors: Matt Korey, Halil Tekinalp, Soydan Ozcan, Peter Wang, Amber Hubbard, David Nuttall, Mitchell Rencheck
  • Publication number: 20240066793
    Abstract: A method of manufacturing an article is provided. The method includes feeding a polymeric material into an extruder including a nozzle, and feeding a continuous fiber into the extruder, the continuous fiber and the polymeric material together forming a molding compound. A three-dimensional preform is formed by discharging the molding compound from the nozzle onto a deposition surface. A mold charge is formed by positioning the three-dimensional preform within a mold that includes a top mold component and a bottom mold component. The mold charge is compression molded within the mold to form a finished article.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 29, 2024
    Inventors: Vipin Kumar, Ahmed A. Hassen, Vlastimil Kunc, Cole Nielsen, David Nuttall
  • Patent number: 11882038
    Abstract: Various data bus monitoring, analysis, and logging systems, devices, and methods are described herein. In one example, an apparatus includes a first circuit configured to monitor first packets among traffic carried by one or more first directional lanes of a communication link established between a host and one or more endpoint devices and determine header information for the first packets. The apparatus includes a second circuit configured to detect second packets among traffic carried by one or more second directional lanes of the communication link based at least in part on the header information determined for the first packets. The apparatus includes an analysis element configured to establish transaction metadata comprising properties of transactions on the communication link based at least on correlations among the first packets and the second packets.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: January 23, 2024
    Assignee: SerialTek, LLC
    Inventors: Paul J. Mutschler, Eric Lanning, David Nuttall, David Freeman
  • Publication number: 20230089389
    Abstract: Various data bus monitoring, analysis, and logging systems, devices, and methods are described herein. In one example, an apparatus includes a first circuit configured to monitor first packets among traffic carried by one or more first directional lanes of a communication link established between a host and one or more endpoint devices and determine header information for the first packets. The apparatus includes a second circuit configured to detect second packets among traffic carried by one or more second directional lanes of the communication link based at least in part on the header information determined for the first packets. The apparatus includes an analysis element configured to establish transaction metadata comprising properties of transactions on the communication link based at least on correlations among the first packets and the second packets.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 23, 2023
    Inventors: Paul J. Mutschler, Eric Lanning, David Nuttall, David Freeman
  • Patent number: 11558296
    Abstract: Various data bus monitoring, analysis, and logging systems, devices, and methods are described herein. In one example, an apparatus includes a first circuit configured to monitor first packets among traffic carried by one or more first directional lanes of a communication link established between a host and one or more endpoint devices and determine header information for the first packets. The apparatus includes a second circuit configured to detect second packets among traffic carried by one or more second directional lanes of the communication link based at least in part on the header information determined for the first packets. The apparatus includes an analysis element configured to establish transaction metadata comprising properties of transactions on the communication link based at least on correlations among the first packets and the second packets.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: January 17, 2023
    Assignee: SerialTek, LLC
    Inventors: Paul J. Mutschler, Eric Lanning, David Nuttall, David Freeman
  • Publication number: 20220094639
    Abstract: Various data bus monitoring, analysis, and logging systems, devices, and methods are described herein. In one example, an apparatus includes a first circuit configured to monitor first packets among traffic carried by one or more first directional lanes of a communication link established between a host and one or more endpoint devices and determine header information for the first packets. The apparatus includes a second circuit configured to detect second packets among traffic carried by one or more second directional lanes of the communication link based at least in part on the header information determined for the first packets. The apparatus includes an analysis element configured to establish transaction metadata comprising properties of transactions on the communication link based at least on correlations among the first packets and the second packets.
    Type: Application
    Filed: September 18, 2020
    Publication date: March 24, 2022
    Inventors: Paul J. Mutschler, Eric Lanning, David Nuttall, David Freeman
  • Publication number: 20050167981
    Abstract: The invention concerns a rapid connection coupling (10) for transferring high-pressure gases and/or liquid, in particular for refilling a high-pressure, mobile container such as a gas cylinder with oxygen in a home environment or at a transfill station with a transfill device. The coupling in question comprises the following elements: a tubular housing (11), an outer sliding sleeve (18) which can slide relative to the housing (11); a number of radially expanding collet chuck elements (15) mounted on the housing (11) and provided with an engaging contour (17) which facilitates connection to a matching connection fitting (30); and a sealing piston (22) capable of sliding centrally inside the housing (11), the said sealing piston being brought into contact with the connecting fitting (30). Internal parts (e.g.
    Type: Application
    Filed: March 27, 2002
    Publication date: August 4, 2005
    Inventors: David Nuttall, Jens Farwer, Wolfgang Weh, Erwin Weh