Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: An asymmetric coherent receiver includes an optical front end configured to split a received optical signal into two paths, wherein the split received optical signal experiences a different optical transfer function in one of the two paths; two photodetectors each configured to detect power one of the split received optical signals in each of the two paths to obtain corresponding electrical signals; and circuitry configured to perform electrical domain extraction of information of each of the corresponding electrical signals from the two paths, wherein the different optical transfer function provides additional information utilized in optical field reconstruction via direct detection.

Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes directed to semiconductor packages that include a glass interposer that includes electrically conductive through glass vias that extend through the interposer. One or more dies may be hybrid bonded to a first side of the glass interposer. In embodiments, the second side of the glass interposer may include a redistribution layer that is electrically coupled with the one or more dies through the through glass vias. Other embodiments may be described and/or claimed.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: A method for separating motile organisms from other organisms. The method comprises controlling a fluid delivery unit to provide a fluid flow to a sample separating device (302). The fluid flow has a sample introduction flow velocity set so that a sample may be introduced into a sample introduction zone of the device. The sample introduction flow velocity is sufficiently high such that an organism in the sample is unable to exit the sample introduction zone. The method comprises controlling the fluid delivery unit to reduce the fluid flow velocity from the sample introduction flow velocity to an operational flow velocity lower than the sample introduction flow velocity (303). The operational flow velocity is selected such that motile organisms in the sample are able to swim against the fluid flow and enter a sample collection zone of the device.

Abstract: A garment may include a first woven component, a second woven component, a space between the first and second woven components defining a channel filled with a fill material, and a third woven component extending such that the first and second woven components are woven together where there is no channel. The channel may be filled with a filler material. Multiple channels may be provided such that they form a zoned pattern in the garment.

Abstract: Aspects of the present invention relate to a method and to a control system for a vehicle, the vehicle comprising an internal combustion engine configured to provide torque to a first axle of the vehicle for generating first axle wheel torque, and an electric machine configured to provide torque to a second axle of the vehicle for generating second axle wheel torque, the method comprising: outputting a torque request for the engine and a torque request for the electric machine, the torque requests having a first ratio dependent on a required torque split between the first axle wheel torque and the second axle wheel torque, wherein received first axle wheel torque and received second axle wheel torque have a second variable ratio dependent on a difference between wheel torque response capabilities of the engine and of the electric machine; determining that a trigger condition is satisfied; and controlling, in dependence on satisfaction of the trigger condition, determination of the torque request for the elect

Abstract: IC chip package routing structures including a metal-insulator-metal (MIM) capacitor integrated with redistribution layers. An active side of an IC chip may be electrically coupled to the redistribution layers through first-level interconnects. The redistribution layers terminate at interfaces suitable for coupling a package to a host component through second-level interconnects. The MIM capacitor structure may comprise materials suitable for high temperature processing, for example of 350° C., or more. The MIM capacitor structure may therefore be fabricated over a host substrate using higher temperature processing. The redistribution layers and MIM capacitor may then be embedded within package dielectric material(s) using lower temperature processing. An IC chip may be attached to the package routing structure, and the package then separated from the host substrate for further assembly to a host component.

Abstract: Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.

Abstract: A harvesting tumbler apparatus includes first and second spaced apart grating segment retainers, and a tumbler grating including a plurality of resiliently tensionable grating segments connected to the first and second grating segment retainers. The resiliently tensionable grating segments extend from each of the first and second grating segment retainers in a spaced apart circular arrangement. The tumbler apparatus further includes a tension mechanism configured to apply a sufficient tension force to the resiliently tensionable grating segments to cause the grating to form a cylindrical shape. In illustrative embodiments, the resiliently tensionable grating segments may include flexible cord segments.

Abstract: Embodiments include semiconductor packages, such as wafer level chip scale packages (WLCSPs), flip chip chip scale packages (FCCSPs), and fan out packages. The WLCSP includes a first doped region on a second doped region, a dielectric on a redistribution layer, where the dielectric is between the redistribution layer and doped regions. The WLCSP also includes a shield over the doped regions, the dielectric, and the redistribution layer, where the shield includes a plurality of surfaces, and at least one of the plurality of surfaces of the shield is on a top surface of the first doped region. The WLCSP may have interconnects coupled to the second doped region and redistribution layer. The shield may be a conductive shield that is coupled to ground, and the shield may be directly coupled to the redistribution layer and first doped region. The first and second doped regions may include highly doped n-type materials.

Abstract: Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: A harvesting tumbler apparatus includes first and second spaced apart grating segment retainers, and a tumbler grating including a plurality of resiliently tensionable grating segments connected to the first and second grating segment retainers. The resiliently tensionable grating segments extend from each of the first and second grating segment retainers in a spaced apart circular arrangement. The tumbler apparatus further includes a tension mechanism configured to apply a sufficient tension force to the resiliently tensionable grating segments to cause the grating to form a cylindrical shape. In illustrative embodiments, the resiliently tensionable grating segments may include flexible cord segments.

Abstract: The present invention encompasses methods of reducing inflammatory immune cell activation and inflammation via inhibiting mitochondrial fission.

Abstract: A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Abstract: The present disclosure encompasses methods of enhancing T cell longevity and/or T cell function by promoting mitochondrial fusion and/or mitochondrial structural remodeling including cristae. Compositions comprising the enhanced T cells may be used in adoptive cellular immunotherapy.

Abstract: Display features of an interactive user interface for a TV environment allow a user to interact with objects and/or information within a display space.

Abstract: A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Abstract: A chip arrangement may include: a semiconductor chip; an encapsulating structure at least partially encapsulating the semiconductor chip, the encapsulating structure having a first side and a second side opposite the first side, the encapsulating structure including a recess over the first side of the encapsulating structure, the recess having a bottom surface located at a first level; and at least one electrical connector disposed at the first side of the encapsulating structure outside the recess, wherein a surface of the at least one electrical connector facing the encapsulating structure may be disposed at a second level different from the first level.