Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for monitoring vehicles traversing a dedicated roadway that includes an at-grade crossing. In some implementations, a system includes a central server, a gate system, and sensors. The gate system provides access to an at-grade crossing for vehicles. The sensors are positioned in a fixed location relative to a roadway, the roadway including the at-grade crossing. Each sensor can detect vehicles on the roadway. For each vehicle, each sensor can generate sensor data and observational data from the generated sensor data. Each sensor can determine a likelihood that the detected vehicle will approach the at-grade crossing by comparing the likelihood to a threshold. In response, each sensor can transmit data to the gate system that causes the gate system to allow the autonomous vehicle access to the at-grade crossing prior to the autonomous vehicle reaching the gate system.

Abstract: The invention concerns polymeric media based on modified natural polysaccharides for removing one or both of Anti-A Antibodies and Anti-B Antibodies from human blood or plasma, the media comprising one or both of (i) a polymeric solid support with a blood group A Antigen ligand attached to the solid support at a ligand loading between 1-5 mg/mL of solid support, and wherein the media is stable under physiological pH conditions, and (ii) a polymeric solid support with a blood group B Antigen ligand attached to the solid support at a ligand loading between 1-5 mg/mL of solid support, and wherein the media is stable under physiological pH conditions.

Abstract: Disclosed herein is an instrument suitable for processing cells for example culturing, concentrating or washing said cells, the instrument comprising: a housing for accommodating mechanical elements including at least one fluid pump; and a disposable processing kit complementary to the mechanical elements within the housing and comprising a fluid circuit including a fluid reservoir and plural fluid paths capable of carrying fluid flow caused by said pump(s), the instrument further including a mechanism for determining the quantity, or change in quantity of the fluid in the reservoir resulting from said fluid flow, the instrument yet further comprising a controller operable to control at least the pump and operable to perform a fault determination process, which includes the steps of determining the expected flow rate of said pump(s) calculated from the speed of the pump(s) and comparing that expected flow with the change in quantity of the fluid in the reservoir as determined by said mechanism.

Abstract: An apparatus and method for treating air. A housing can enclose a heating zone and an oxidizing zone positioned downstream of the heating zone with respect to a flow direction of the air being treated. A catalyst in the oxidizing zone oxidizes contaminants from the air, and an air mover positioned is configured to move air from an air inlet through the housing to an air outlet. An air treatment cycle can include an air cleaning mode at a high air flow and a self-cleaning mode at a lower air flow. A heater is operated during the self cleaning mode to oxidize contaminants that on the catalyst from the air cleaning mode.

Abstract: A method includes capturing, by a content generation component of a computing device, initial content comprising video, and audio associated with the video; identifying one or more audio clips in the audio associated with the video based on one or more transient points in the audio; extracting, for each audio clip, a corresponding video clip from the video of the initial content; providing a control interface to enable a user-generated sequence of audio clips, wherein each audio clip in the sequence of audio clips is selected from the one or more identified audio clips; generating new audiovisual content comprising a sequence of video clips to correspond to the user-generated sequence of audio clips, wherein each video clip in the sequence of video clips is the extracted corresponding video clip for each audio clip in the user-generated sequence of audio clips; and providing, by the control interface, the new audiovisual content.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for monitoring a dedicated roadway the runs in parallel to a railroad. In some implementations, a system includes a central server, an interface, and sensors. The interface receives data from a railroad system that manages the railroad parallel to the dedicated roadway. The sensors are positioned in a fixed location relative to the dedicated roadway. Each sensor can detect vehicles in a first field of view on the dedicated roadway. For each detected vehicle, each sensor can generate sensor data based on the detected vehicle in the dedicated roadway and the data received at the interface. Each sensor can generate observational data and instruct the detected vehicle to switch to an enhanced processing mode. Each sensor can determine an action for the detected vehicle to take based on the generated observational data.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes directed to semiconductor packages that include a glass interposer that includes electrically conductive through glass vias that extend through the interposer. One or more dies may be hybrid bonded to a first side of the glass interposer. In embodiments, the second side of the glass interposer may include a redistribution layer that is electrically coupled with the one or more dies through the through glass vias. Other embodiments may be described and/or claimed.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: IC chip package routing structures including a metal-insulator-metal (MIM) capacitor integrated with redistribution layers. An active side of an IC chip may be electrically coupled to the redistribution layers through first-level interconnects. The redistribution layers terminate at interfaces suitable for coupling a package to a host component through second-level interconnects. The MIM capacitor structure may comprise materials suitable for high temperature processing, for example of 350° C., or more. The MIM capacitor structure may therefore be fabricated over a host substrate using higher temperature processing. The redistribution layers and MIM capacitor may then be embedded within package dielectric material(s) using lower temperature processing. An IC chip may be attached to the package routing structure, and the package then separated from the host substrate for further assembly to a host component.

Abstract: Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.

Abstract: A harvesting tumbler apparatus includes first and second spaced apart grating segment retainers, and a tumbler grating including a plurality of resiliently tensionable grating segments connected to the first and second grating segment retainers. The resiliently tensionable grating segments extend from each of the first and second grating segment retainers in a spaced apart circular arrangement. The tumbler apparatus further includes a tension mechanism configured to apply a sufficient tension force to the resiliently tensionable grating segments to cause the grating to form a cylindrical shape. In illustrative embodiments, the resiliently tensionable grating segments may include flexible cord segments.

Abstract: Embodiments include semiconductor packages, such as wafer level chip scale packages (WLCSPs), flip chip chip scale packages (FCCSPs), and fan out packages. The WLCSP includes a first doped region on a second doped region, a dielectric on a redistribution layer, where the dielectric is between the redistribution layer and doped regions. The WLCSP also includes a shield over the doped regions, the dielectric, and the redistribution layer, where the shield includes a plurality of surfaces, and at least one of the plurality of surfaces of the shield is on a top surface of the first doped region. The WLCSP may have interconnects coupled to the second doped region and redistribution layer. The shield may be a conductive shield that is coupled to ground, and the shield may be directly coupled to the redistribution layer and first doped region. The first and second doped regions may include highly doped n-type materials.

Abstract: Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Abstract: A harvesting tumbler apparatus includes first and second spaced apart grating segment retainers, and a tumbler grating including a plurality of resiliently tensionable grating segments connected to the first and second grating segment retainers. The resiliently tensionable grating segments extend from each of the first and second grating segment retainers in a spaced apart circular arrangement. The tumbler apparatus further includes a tension mechanism configured to apply a sufficient tension force to the resiliently tensionable grating segments to cause the grating to form a cylindrical shape. In illustrative embodiments, the resiliently tensionable grating segments may include flexible cord segments.

Abstract: The present invention encompasses methods of reducing inflammatory immune cell activation and inflammation via inhibiting mitochondrial fission.

Abstract: A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Abstract: The present disclosure encompasses methods of enhancing T cell longevity and/or T cell function by promoting mitochondrial fusion and/or mitochondrial structural remodeling including cristae. Compositions comprising the enhanced T cells may be used in adoptive cellular immunotherapy.

Abstract: Display features of an interactive user interface for a TV environment allow a user to interact with objects and/or information within a display space.