Patents by Inventor David Oberson

David Oberson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HETEROGENEOUS SOLDER BUMP STRUCTURE
    Publication number: 20240113060
    Abstract: There is provided a solder bump structure comprising an under bump metallurgy (UBM) layer, a first solder portion over the UBM layer, the first solder portion having a first composition, a barrier layer encapsulating the first solder portion, and a second solder portion over the barrier layer, the second solder portion having a second composition different from the first composition.
    Type: Application
    Filed: February 22, 2021
    Publication date: April 4, 2024
    Inventors: Abderrahim EL AMRANI, Etienne PARADIS, David DANOVITCH, Dominique DROUIN, Valerie OBERSON, Michel TURGEON, Clement FORTIN
  • Automotive vehicle rear seat storage system
    Patent number: 6161896
    Abstract: A selectively operable storage system incorporated within the passenger compartment of an automotive vehicle is described. The storage system is preferably deployed underneath the rear seat structure, for example, below the seat bottom structure. The storage system can include any number and combination of selectively operable sliding trays, pivoting trays, collapsible trays, pivoting lids, storage bins, and track systems.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: December 19, 2000
    Assignee: DaimlerChrysler Corporation
    Inventors: Victor Johnson, Dorinel Neag, Daniel W. Husted, David J. Cauvin, David Oberson