Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row, each printhead module having at least four rows of print chips configured for printing at least four different inks, each print chip having multiple nozzle rows for redundant printing of a respective ink. A print zone of the printhead has a width of less than 100 mm in a media direction.

Abstract: A printhead module includes: a monolithic substrate having alternate longitudinal slots and longitudinal ink supply channels defined through a thickness of the substrate and extending parallel with each other along a length of the substrate; and a plurality of rows of print chips mounted on a front face of the substrate, each row of print chips receiving ink only from a respective one of the ink supply channels. Each one of the longitudinal slots is configured to supply power and data only to a respective one of the rows of print chips.

Abstract: A modular inkjet printhead includes: a plurality of printhead modules arranged end on end in a row; an elongate support structure extending a length of the printhead for holding the printhead modules; and an ink carrier extending alongside the support structure and laterally spaced from the printhead modules, the ink carrier being fluidically connected to each of the printhead modules via a plurality of ink connectors extending laterally therefrom; and a pair of elongate busbars extending longitudinally along a roof of the ink carrier, each busbar being electrically connected to each of the printhead modules via a pair of respective connector straps extending transversely therefrom, the busbars supplying power to each of the printhead modules.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of ink supply channels; a plurality of print chips mounted on the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger comprising at least a portion of a respective print chip. The fingers of neighboring printhead modules are interdigitated such that print chips of neighboring printhead modules overlap and the portion of the print chip contained in a respective finger is positioned towards one lateral edge of the finger.

Abstract: A printhead module includes a monolithic substrate having a plurality of rows of print chips mounted thereon. Each row of print chips receives power and data through a respective longitudinal slot defined through a thickness of the substrate, each longitudinal slot extending parallel with and offset from the rows of print chips.

Abstract: A printhead module includes: an ink manifold defining a plurality of ink supply channels, the ink manifold having first and second opposite faces; a plurality of print chips mounted on the first face, each print chip receiving ink from a respective ink supply channel via a set of ink outlets defined in the first face; first PCBs mounted on the first face of the ink manifold, each print chip being electrically connected to a respective first PCB; and second PCBs mounted on the second face of the ink manifold. The first and second PCBs are connected via electrical connectors extending through longitudinal slots defined in the substrate.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of parallel ink supply channels extending longitudinally along a length thereof and a plurality of parallel printhead segments. Each printhead segment extends longitudinally along a length of the substrate and has a plurality of print chips arranged end on end in a row. A plurality of fingers extend longitudinally from opposite ends of each printhead module, each finger including a portion of a respective one of the printhead segments. The fingers of neighboring printhead modules are interdigitated such that printhead segments of neighboring printhead modules overlap.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of longitudinal ink supply channels; a plurality of print chips mounted on a first face of the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger having an ink port extending away from a second face of the substrate opposite the first face, each ink port being in fluid communication with a respective ink supply channel Each ink supply channel is connected to a respective pair of ink ports at opposite ends of each printhead module and the fingers of neighboring printhead modules are interdigitated such that the ink ports of neighboring printhead modules overlap.

Abstract: A printhead module includes a monolithic substrate having a plurality of rows of print chips mounted thereon. Each row of print chips receives power and data through a respective longitudinal slot defined through a thickness of the substrate, each longitudinal slot extending parallel with and offset from the rows of print chips.

Abstract: A modular inkjet printhead includes: a plurality of printhead modules arranged end on end in a row; an elongate support structure extending a length of the printhead for holding the printhead modules; and an ink carrier extending alongside the support structure and laterally spaced from the printhead modules, the ink carrier being fluidically connected to each of the printhead modules via a plurality of ink connectors extending laterally therefrom; and a pair of elongate busbars extending longitudinally along a roof of the ink carrier, each busbar being electrically connected to each of the printhead modules via a pair of respective connector straps extending transversely therefrom, the busbars supplying power to each of the printhead modules.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of parallel ink supply channels extending longitudinally along a length thereof and a plurality of parallel printhead segments. Each printhead segment extends longitudinally along a length of the substrate and has a plurality of print chips arranged end on end in a row. A plurality of fingers extend longitudinally from opposite ends of each printhead module, each finger including a portion of a respective one of the printhead segments. The fingers of neighboring printhead modules are interdigitated such that printhead segments of neighboring printhead modules overlap.

Abstract: A printhead module includes: an ink manifold defining a plurality of ink supply channels, the ink manifold having first and second opposite faces; a plurality of print chips mounted on the first face, each print chip receiving ink from a respective ink supply channel via a set of ink outlets defined in the first face; first PCBs mounted on the first face of the ink manifold, each print chip being electrically connected to a respective first PCB; and second PCBs mounted on the second face of the ink manifold. The first and second PCBs are connected via electrical connectors extending through longitudinal slots defined in the substrate.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of ink supply channels; a plurality of print chips mounted on the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger comprising at least a portion of a respective print chip. The fingers of neighboring printhead modules are interdigitated such that print chips of neighboring printhead modules overlap and the portion of the print chip contained in a respective finger is positioned towards one lateral edge of the finger.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row, each printhead module having at least four rows of print chips configured for printing at least four different inks, each print chip having multiple nozzle rows for redundant printing of a respective ink. A print zone of the printhead has a width of less than 100 mm in a media direction.

Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of longitudinal ink supply channels; a plurality of print chips mounted on a first face of the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger having an ink port extending away from a second face of the substrate opposite the first face, each ink port being in fluid communication with a respective ink supply channel Each ink supply channel is connected to a respective pair of ink ports at opposite ends of each printhead module and the fingers of neighboring printhead modules are interdigitated such that the ink ports of neighboring printhead modules overlap.

Abstract: A printing unit includes: a sleeve and a print module received in the sleeve, the print module being slidably removable, in a first direction, from the sleeve. The print module includes a supply module and a replaceable printhead. The printhead is slidably removable, in a second direction, from the supply module, the first and second directions being non-parallel.

Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.

Abstract: The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.