Abstract: The present disclosure describes an alignment fixture having particular application in surface-mount connector technology. The fixture utilizes a plurality of through-hole connector sections having pins which are retained in holes formed in a plate and which exhibit a predetermined positional tolerance. A plurality of surface-mount connector sections to be mounted adjacently on the edge of a printed circuit board are plugged into mating through-hole connector sections, and positioned with respect to conductive pads on the board surface. In effect, the above-mentioned positional tolerance has been transferred by the fixture to the surface-mount connector sections.

Abstract: The present disclosure describes a universal leadless chip carrier mounting pad layout for an interconnection medium such as a printed circuit board, which accommodates a wide range of chip carrier sizes. Thus, there is eliminated the traditional method of providing custom pad layouts homologously configured as to numbers of pads and their arrangement, in specific chip carriers. The universality of the present pad layout makes it especially desirable for prototype designs, and integrated circuit chip "burn in" and test procedures.