Patents by Inventor David P. DeKraker

David P. DeKraker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WET PROCESSING OF MICROELECTRONIC SUBSTRATES WITH CONTROLLED MIXING OF FLUIDS PROXIMAL TO SUBSTRATE SURFACES
    Publication number: 20230352321
    Abstract: The present invention provides methods and apparatuses for controlling the transition between first and second treatment fluids during processing of microelectronic devices using spray processor tools.
    Type: Application
    Filed: July 10, 2023
    Publication date: November 2, 2023
    Inventors: Thomas J. Wagener, Jeffery W. Butterbaugh, David P. DeKraker
  • Method and apparatus for treating a workpiece with arrays of nozzles
    Patent number: 9666456
    Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: May 30, 2017
    Assignee: TEL FSI, INC.
    Inventors: Jimmy D. Collins, David P. DeKraker, Tracy A. Gast, Alan D. Rose
  • Acid treatment strategies useful to fabricate microelectronic devices and precursors thereof
    Patent number: 9412628
    Abstract: A method of treating one or more wafers is provided. The method comprises the steps of: a) providing at least one wafer, that has first and second opposed major faces and at least one feature, such as a metal silicide, that is sensitive to a neutralizing chemistry on the first major face; b) causing an acidic chemistry, such as a sulfuric acid and/or phosphoric acid, to contact the first major face of the wafer and causing the wafer to spin; c) after causing the acidic chemistry to contact the wafer, causing a non-etching rinsing fluid to contact the first major face while the wafer is spinning; and d) during at least a portion of the time that the non-etching rinsing fluid is caused to contact the first major face of the spinning wafer, causing a neutralizing liquid to contact the second major face of the spinning wafer.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: August 9, 2016
    Assignee: TEL FSI, INC.
    Inventor: David P. DeKraker
  • METHOD AND APPARATUS FOR TREATING A WORKPIECE WITH ARRAYS OF NOZZLES
    Publication number: 20150170941
    Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
    Type: Application
    Filed: March 2, 2015
    Publication date: June 18, 2015
    Inventors: Jimmy D. Collins, David P. DeKraker, Tracy A. Gast, Alan D. Rose
  • Method and apparatus for treating a workpiece with arrays of nozzles
    Patent number: 8978675
    Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: March 17, 2015
    Assignee: Tel FSI, Inc.
    Inventors: Jimmy D. Collins, David P. DeKraker, Tracy A. Gast, Alan D. Rose
  • Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
    Patent number: 8967167
    Abstract: The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: March 3, 2015
    Assignee: Tel FSI, Inc.
    Inventors: Jimmy D. Collins, David P. DeKraker, Tracy A. Gast, Alan D. Rose
  • Method of removing liquid from a barrier structure
    Patent number: 8668778
    Abstract: The present invention provides methods of removing liquid from a barrier structure in the context of treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: March 11, 2014
    Assignee: TEL FSI, INc.
    Inventors: Jimmy D. Collins, David P. DeKraker, Tracy A. Gast, Alan D. Rose
  • ACID TREATMENT STRATEGIES USEFUL TO FABRICATE MICROELECTRONIC DEVICES AND PRECURSORS THEREOF
    Publication number: 20130000682
    Abstract: A method of treating one or more wafers is provided. The method comprises the steps of: a) providing at least one wafer, that has first and second opposed major faces and at least one feature, such as a metal silicide, that is sensitive to a neutralizing chemistry on the first major face; b) causing an acidic chemistry, such as a sulfuric acid and/or phosphoric acid, to contact the first major face of the wafer and causing the wafer to spin; c) after causing the acidic chemistry to contact the wafer, causing a non-etching rinsing fluid to contact the first major face while the wafer is spinning; and d) during at least a portion of the time that the non-etching rinsing fluid is caused to contact the first major face of the spinning wafer, causing a neutralizing liquid to contact the second major face of the spinning wafer.
    Type: Application
    Filed: June 11, 2012
    Publication date: January 3, 2013
    Inventor: David P. DeKraker