Patents by Inventor David P. Fouts

David P. Fouts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromigration lifetime increase of lead base alloys
    Patent number: 4622205
    Abstract: Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.
    Type: Grant
    Filed: April 12, 1985
    Date of Patent: November 11, 1986
    Assignee: IBM Corporation
    Inventors: David P. Fouts, Devandra Gupta, Paul S. Ho, Jasvir S. Jaspal, James R. Lloyd, Jr., James M. Oberschmidt, Kris V. Srikrishnan, Michael J. Sullivan