Patents by Inventor David P. Groppi

David P. Groppi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5464658
    Abstract: Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.
    Type: Grant
    Filed: May 19, 1994
    Date of Patent: November 7, 1995
    Assignee: AlliedSignal Inc.
    Inventors: Donald E. Yuhas, Carol L. Vorres, David P. Groppi, Jiri D. Konicek
  • Patent number: 5350621
    Abstract: Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: September 27, 1994
    Assignee: Allied-Signal Inc.
    Inventors: Donald E. Yuhas, Carol L. Vorres, David P. Groppi, Jiri D. Konicek
  • Patent number: 5244720
    Abstract: A protective layer for polymeric composite substrates comprises a fiber-reinforced glass composite having a refractory fiber in a matrix of a black glass ceramic having the empirical formula SiCxOy where x ranges from about 0.5 to about 2.0, preferably 0.9 to 1.6 and y ranges from about 0.5 to 3.0, preferably 0.7 to 1.8. The black glass ceramic is derived from cyclosiloxane monomers containing a vinyl group attached to silicon and/or a hydride-silicon group.
    Type: Grant
    Filed: April 19, 1991
    Date of Patent: September 14, 1993
    Assignee: Allied-Signal Inc.
    Inventors: Roger Y. Leung, Stephen T. Gonczy, Donald E. Yuhas, David P. Groppi