Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An translucent finish is deposited over the thin metal layer to provide protection for the metal finish.

Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An organic coating layer is deposited over the thin metal layer to provide protection for the metal finish.

Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An translucent finish is deposited over the thin metal layer to provide protection for the metal finish.

Abstract: A process for preparing a chrome substrate for application of a polymer coating, wherein the substrate preparation enhances adhesion and durability of the adhesion between the chrome substrate and the polymer coating, involves contacting the chrome substrate with an acid solution for a period of time sufficient to modify the surface of the chrome substrate. In certain embodiments, the acid treatment is an anodic treatment. In accordance with certain aspects of this invention, the acid treated chrome surface is further treated with a silane compound to enhance adhesion with a subsequently applied polymer coating composition.

Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

Abstract: A process for preparing a chrome substrate for application of a polymer coating, wherein the substrate preparation enhances adhesion and durability of the adhesion between the chrome substrate and the polymer coating, involves contacting the chrome substrate with an acid solution for a period of time sufficient to modify the surface of the chrome substrate. In certain embodiments, the acid treatment is an anodic treatment. In accordance with certain aspects of this invention, the acid treated chrome surface is further treated with a silane compound to enhance adhesion with a subsequently applied polymer coating composition.

Abstract: A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.