Patents by Inventor David P. Kopp

David P. Kopp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240055157
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 15, 2024
    Inventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
  • Patent number: 11810689
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: November 7, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, James David Stewart, David P. Kopp, Elene Chobanyan
  • Publication number: 20220418093
    Abstract: One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 29, 2022
    Inventors: David P. Kopp, Karl J. Bois, Steven J. Martin
  • Publication number: 20220115166
    Abstract: A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 14, 2022
    Inventors: KARL J. BOIS, JAMES DAVID STEWART, DAVID P. KOPP, ELENE CHOBANYAN
  • Patent number: 10491342
    Abstract: An example communications device may include a slicer that may generate a digital output signal by thresholding a received signal according to variably set timing and voltage parameters. Testing circuitry may determine expected bit error ratios for multiple time-voltage slicer by performing test operations corresponding respectively to the multiple time-voltage slices. Each of the test operations may include setting the timing and voltage parameters of the slicer based on the corresponding time-voltage slice, periodically measuring a number of total bits and a number of erroneous bits based on the digital output signal and calculating a two-sided bit error ratio frequentist confidence interval (FCI) size from the measured bit error ratio. The measured bit error ratio is output in response to the two-sided bit error ratio FCI being less than or equal to a two-sided bit error ratio interval target size.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: November 26, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Benjamin Toby, David P. Kopp, Karl J Bois
  • Patent number: 9712263
    Abstract: An example communications device may include a slicer that may generate a digital output signal by thresholding a received signal according to variably set timing and voltage parameters. Testing circuitry may determine expected bit error ratios for multiple time-voltage slices by performing test operations corresponding respectively to the multiple time-voltage slices. Each of the test operations may include setting the timing and voltage parameters of the slicer based on the corresponding time-voltage slice, periodically measuring a bit error ratio based on the digital output signal and determining a confidence level for the measured bit error ratio, and in response to the determined confidence level equaling or exceeding a specified value, designating a current value of the measured bit-error ratio as the expected bit error ratio for the corresponding time-voltage slice and ending the test operation.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 18, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Benjamin Toby, David P. Kopp