Patents by Inventor David P. Potasek

David P. Potasek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10861665
    Abstract: A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: December 8, 2020
    Assignee: Rosemount Aerospace Inc.
    Inventors: Roger Alan Backman, David P. Potasek
  • Publication number: 20200373042
    Abstract: Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.
    Type: Application
    Filed: May 20, 2019
    Publication date: November 26, 2020
    Inventor: David P. Potasek
  • Publication number: 20200373109
    Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 26, 2020
    Inventors: David P. Potasek, Ben Ping-Tao Fok, Roger Alan Backman
  • Publication number: 20200370981
    Abstract: A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 26, 2020
    Inventors: Michael Robert Daup, David P. Potasek
  • Publication number: 20200355568
    Abstract: A pressure sensor assembly is formed by: forming an inlet channel by brazing a transition portion to a pressure port with a high temperature brazing processes, wherein the transition portion and the pressure port are both hollow tubular members and are formed of different materials, the pressure port including a base and a projection extending therefrom; after the inlet channel is formed, joining a header and a sensor to the pressure port with a soldering process that is at a lower temperature than the high temperature brazing process, wherein the header is joined to the base of the pressure port and the sensor is joined to the projection of the pressure port and is in fluid communication with a fluid to be measured through the pressure port; and welding a cover to the header.
    Type: Application
    Filed: May 6, 2019
    Publication date: November 12, 2020
    Inventors: Jim Golden, David P. Potasek, Robert Stuelke
  • Patent number: 10823692
    Abstract: A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: November 3, 2020
    Assignee: CARRIER CORPORATION
    Inventors: John Carl Christenson, David P. Potasek, Marcus Allen Childress
  • Publication number: 20200326295
    Abstract: A gas detection device is provided. The device includes a substrate and a dielectric material applied to the substrate. A sensor material is applied to the dielectric film. The sensor material has a bottom, a side, and a top surface. An electrode material is at least partially applied to the dielectric film and at least partially applied to a portion of the side of the sensor material and a portion of the top surface of the sensor material to pin a portion of the sensor material to the dielectric material. The electrode material forms a vapor barrier upon the sensor material to facilitate preventing delamination between the sensor material and the electrode material over portions of the sensor material where the sensor material is not pinned to the dielectric material.
    Type: Application
    Filed: May 17, 2017
    Publication date: October 15, 2020
    Applicant: Carrier Corporation
    Inventors: David P. POTASEK, John Carl CHRISTENSON, Roger Alan BACKMAN
  • Publication number: 20200326296
    Abstract: A gas detection device is provided having a substrate. A sensing element is coupled to the substrate and constructed and arranged to sense a target gas. A top surface is positioned on the sensing element opposite the substrate. A dopant is disposed within the sensing element. The dopant enhances the ability of the sensing element to sense the target gas. An electric field is applied to the dopant to constrain the dopant at or near the top surface of the sensing element.
    Type: Application
    Filed: May 17, 2017
    Publication date: October 15, 2020
    Applicant: Carrier Corporation
    Inventors: John Carl CHRISTENSON, David P. POTASEK
  • Patent number: 10782315
    Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: September 22, 2020
    Assignee: Rosemount Aerospace Inc.
    Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
  • Patent number: 10656035
    Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: May 19, 2020
    Assignee: Rosemount Aerospace Inc.
    Inventors: Timothy Thomas Golly, David P. Potasek, Cuong Tho Huynh
  • Publication number: 20200041371
    Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Inventors: Timothy Thomas Golly, David P. Potasek, Cuong Tho Huynh
  • Patent number: 10481025
    Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: November 19, 2019
    Assignee: Rosemount Aerospace Inc.
    Inventors: Timothy Thomas Golly, David P. Potasek, Cuong Tho Huynh
  • Publication number: 20190212313
    Abstract: An isolated sensor and method of isolating a sensor are provided. The isolated sensor includes a mounting portion, a sensor portion disposed adjacent to the mounting portion, and at least one pedestal connecting a mounting portion to a sensor portion.
    Type: Application
    Filed: August 18, 2017
    Publication date: July 11, 2019
    Inventors: John Carl Christenson, David P. Potasek, Roger Alan Backman
  • Publication number: 20190154729
    Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
  • Patent number: 10273149
    Abstract: A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: April 30, 2019
    Assignee: CARRIER CORPORATION
    Inventors: David P. Potasek, John Carl Christenson, Marcus Allen Childress
  • Publication number: 20180299482
    Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 18, 2018
    Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
  • Patent number: 10101234
    Abstract: A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: October 16, 2018
    Assignee: Rosemount Aerospace, Inc.
    Inventors: David P. Potasek, Charles Little, Weibin Zhang
  • Publication number: 20180209863
    Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 26, 2018
    Inventors: Timothy Thomas Golly, David P. Potasek, Cuong Tho Huynh
  • Patent number: 9963341
    Abstract: A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 8, 2018
    Assignee: Rosemount Aerospace, Inc.
    Inventors: David P. Potasek, Robert Stuelke
  • Patent number: 9878904
    Abstract: A MEMS device with electronics integration places integrated circuit components on a topping wafer of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer and secured in a housing.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: January 30, 2018
    Assignee: Rosemount Aerospace Inc.
    Inventor: David P. Potasek