Abstract: A plate of metal is bonded to a plate of and electrical insulator and the metal is cut through into a plurality of parallel channels, or recesses, each of a dimension to receive a laser diode (bar). A laser diode is positioned in each of the channels and a solder preform, positioned on the top of the laser diode bars. Is heated to flow around each laser diode bar to secure it in place. A highly manufacturable laser diode assembly having a higher heat capacity results for bonding to a heat sink.

Abstract: An array of laser diodes, or laser diode bars, is formed by positioning adjacent diodes or bars in an offset or staircase arrangement where the emitting facets of adjacent diodes, or bars, are in different planes. The offset arrangement permits the light from adjacent facets to be separated a distance q much shorter than permitted by prior art stacking arrangements because thermal and mechanical constraints characteristic of prior art stacks, are relaxed considerably in the offset arrangement. Power densities of 2000 watts/cm.sup.2 (cw) are achieved with spacings of 0.6 mm between adjacent laser bars, a ten fold increase in power density over in-plane (prior art) positioning of like components.

Abstract: Laser diode bars with a plurality of light emitting facets have the light from those facets coupled into corresponding fibers of a fiber optic bundle via a microlens having a superconic cross section. An improvement in energy coupling of the typically less than 85 percent to up to 95 percent is achieved.